Datasheet
Table Of Contents
- Cisco ONS 15454 SDH Reference Manual
- Contents
- About this Manual
- Shelf and FMEC Hardware
- 1.1 Overview
- 1.2 Front Door
- 1.3 Front Mount Electrical Connection
- 1.4 E1-75/120 Conversion Panel
- 1.5 Coaxial Cable
- 1.6 Twisted-Pair Balanced Cable
- 1.7 Ethernet Cables
- 1.8 Cable Routing and Management
- 1.9 Fiber Management
- 1.10 Fan-Tray Assembly
- 1.11 Power and Ground Description
- 1.12 Alarm, Timing, LAN, and Craft Pin Connections
- 1.13 Cards and Slots
- 1.14 Software and Hardware Compatibility
- Common Control Cards
- Electrical Cards
- 3.1 Electrical Card Overview
- 3.2 E1-N-14 Card
- 3.3 E1-42 Card
- 3.4 E3-12 Card
- 3.5 DS3i-N-12 Card
- 3.6 STM1E-12 Card
- 3.7 FILLER Card
- 3.8 FMEC-E1 Card
- 3.9 FMEC-DS1/E1 Card
- 3.10 FMEC E1-120NP Card
- 3.11 FMEC E1-120PROA Card
- 3.12 FMEC E1-120PROB Card
- 3.13 E1-75/120 Impedance Conversion Panel
- 3.14 FMEC-E3/DS3 Card
- 3.15 FMEC STM1E 1:1 Card
- 3.16 BLANK-FMEC Faceplate
- 3.17 MIC-A/P FMEC
- 3.18 MIC-C/T/P FMEC
- Optical Cards
- 4.1 Optical Card Overview
- 4.2 OC3 IR 4/STM1 SH 1310 Card
- 4.3 OC3 IR/STM1 SH 1310-8 Card
- 4.4 OC12 IR/STM4 SH 1310 Card
- 4.5 OC12 LR/STM4 LH 1310 Card
- 4.6 OC12 LR/STM4 LH 1550 Card
- 4.7 OC12 IR/STM4 SH 1310-4 Card
- 4.8 OC48 IR/STM16 SH AS 1310 Card
- 4.9 OC48 LR/STM16 LH AS 1550 Card
- 4.10 OC48 ELR/STM16 EH 100 GHz Cards
- 4.11 OC192 SR/STM64 IO 1310 Card
- 4.12 OC192 IR/STM64 SH 1550 Card
- 4.13 OC192 LR/STM64 LH 1550 Card
- 4.14 OC192 LR/STM64 LH ITU 15xx.xx Card
- 4.15 15454_MRC-12 Multirate Card
- 4.16 OC192SR1/STM64IO Short Reach and OC192/STM64 Any Reach Cards
- 4.17 SFPs and XFPs
- Ethernet Cards
- Storage Access Networking Cards
- Card Protection
- Cisco Transport Controller Operation
- Security
- Timing
- Circuits and Tunnels
- 11.1 Overview
- 11.2 Circuit Properties
- 11.3 Cross-Connect Card Bandwidth
- 11.4 DCC Tunnels
- 11.5 Multiple Destinations for Unidirectional Circuits
- 11.6 Monitor Circuits
- 11.7 SNCP Circuits
- 11.8 MS-SPRing Protection Channel Access Circuits
- 11.9 MS-SPRing VC4 Squelch Table
- 11.10 Section and Path Trace
- 11.11 Path Signal Label, C2 Byte
- 11.12 Automatic Circuit Routing
- 11.13 Manual Circuit Routing
- 11.14 Constraint-Based Circuit Routing
- 11.15 Virtual Concatenated Circuits
- 11.16 Bridge and Roll
- 11.17 Merged Circuits
- 11.18 Reconfigured Circuits
- 11.19 Server Trails
- SDH Topologies and Upgrades
- Management Network Connectivity
- 13.1 IP Networking Overview
- 13.2 IP Addressing Scenarios
- 13.2.1 Scenario 1: CTC and ONS 15454 SDH Nodes on Same Subnet
- 13.2.2 Scenario 2: CTC and ONS 15454 SDH Nodes Connected to a Router
- 13.2.3 Scenario 3: Using Proxy ARP to Enable an ONS 15454 SDH Gateway
- 13.2.4 Scenario 4: Default Gateway on CTC Computer
- 13.2.5 Scenario 5: Using Static Routes to Connect to LANs
- 13.2.6 Scenario 6: Using OSPF
- 13.2.7 Scenario 7: Provisioning the ONS 15454 SDH Proxy Server
- 13.2.8 Scenario 8: Dual GNEs on a Subnet
- 13.2.9 Scenario 9: IP Addressing with Secure Mode Enabled
- 13.3 Provisionable Patchcords
- 13.4 Routing Table
- 13.5 External Firewalls
- 13.6 Open GNE
- 13.7 TCP/IP and OSI Networking
- 13.7.1 Point-to-Point Protocol
- 13.7.2 Link Access Protocol on the D Channel
- 13.7.3 OSI Connectionless Network Service
- 13.7.4 OSI Routing
- 13.7.5 TARP
- 13.7.6 TCP/IP and OSI Mediation
- 13.7.7 OSI Virtual Routers
- 13.7.8 IP-over-CLNS Tunnels
- 13.7.9 OSI/IP Networking Scenarios
- 13.7.9.1 OSI/IP Scenario 1: IP OSS, IP DCN, ONS GNE, IP DCC, and ONS ENE
- 13.7.9.2 OSI/IP Scenario 2: IP OSS, IP DCN, ONS GNE, OSI DCC, and Other Vendor ENE
- 13.7.9.3 OSI/IP Scenario 3: IP OSS, IP DCN, Other Vendor GNE, OSI DCC, and ONS ENE
- 13.7.9.4 OSI/IP Scenario 4: Multiple ONS DCC Areas
- 13.7.9.5 OSI/IP Scenario 5: GNE Without an OSI DCC Connection
- 13.7.9.6 OSI/IP Scenario 6: IP OSS, OSI DCN, ONS GNE, OSI DCC, and Other Vendor ENE
- 13.7.9.7 OSI/IP Scenario 7: OSI OSS, OSI DCN, Other Vendor GNE, OSI DCC, and ONS NEs
- 13.7.9.8 OSI/IP Scenario 8: OSI OSS, OSI DCN, ONS GNE, OSI DCC, and Other Vendor NEs
- 13.7.10 Provisioning OSI in CTC
- Alarm Monitoring and Management
- 14.1 Overview
- 14.2 LCD Alarm Counts
- 14.3 Alarm Information
- 14.4 Alarm Severities
- 14.5 Alarm Profiles
- 14.6 Alarm Suppression
- 14.7 External Alarms and Controls
- Performance Monitoring
- 15.1 Threshold Performance Monitoring
- 15.2 Intermediate-Path Performance Monitoring
- 15.3 Pointer Justification Count Performance Monitoring
- 15.4 Performance Monitoring Parameter Definitions
- 15.5 Performance Monitoring for Electrical Cards
- 15.6 Performance Monitoring for Ethernet Cards
- 15.6.1 E-Series Ethernet Card Performance Monitoring Parameters
- 15.6.2 G-Series Ethernet Card Performance Monitoring Parameters
- 15.6.3 ML-Series Ethernet Card Performance Monitoring Parameters
- 15.6.4 CE-Series Ethernet Card Performance Monitoring Parameters
- 15.6.4.1 CE-Series Ether Ports Statistics Parameters
- 15.6.4.2 CE-Series Card Ether Ports Utilization Parameters
- 15.6.4.3 CE-Series Card Ether Ports History Parameters
- 15.6.4.4 CE-Series POS Ports Statistics Parameters
- 15.6.4.5 CE-Series Card POS Ports Utilization Parameters
- 15.6.4.6 CE-Series Card Ether Ports History Parameters
- 15.7 Performance Monitoring for Optical Cards
- 15.8 Performance Monitoring for the Fiber Channel Card
- SNMP
- 16.1 SNMP Overview
- 16.2 Basic SNMP Components
- 16.3 SNMP External Interface Requirement
- 16.4 SNMP Version Support
- 16.5 SNMP Message Types
- 16.6 SNMP Management Information Bases
- 16.7 SNMP Trap Content
- 16.8 SNMP Community Names
- 16.9 Proxy Over Firewalls
- 16.10 Remote Monitoring
- Hardware Specifications
- A.1 Shelf Specifications
- A.2 SFP and XFP Specifications
- A.3 General Card Specifications
- A.4 Common Control Card Specifications
- A.5 Electrical Card and FMEC Specifications
- A.5.1 E1-N-14 Card Specifications
- A.5.2 E1-42 Card Specifications
- A.5.3 E3-12 Card Specifications
- A.5.4 DS3i-N-12 Card Specifications
- A.5.5 STM1E-12 Card Specifications
- A.5.6 FILLER Card
- A.5.7 FMEC-E1 Specifications
- A.5.8 FMEC-DS1/E1 Specifications
- A.5.9 FMEC E1-120NP Specifications
- A.5.10 FMEC E1-120PROA Specifications
- A.5.11 FMEC E1-120PROB Specifications
- A.5.12 E1-75/120 Impedance Conversion Panel Specifications
- A.5.13 FMEC-E3/DS3 Specifications
- A.5.14 FMEC STM1E 1:1 Specifications
- A.5.15 BLANK-FMEC Specifications
- A.5.16 MIC-A/P Specifications
- A.5.17 MIC-C/T/P Specifications
- A.6 Optical Card Specifications
- A.6.1 OC3 IR 4/STM1 SH 1310 Card Specifications
- A.6.2 OC3 IR/STM1 SH 1310-8 Card Specifications
- A.6.3 OC12 IR/STM4 SH 1310 Card Specifications
- A.6.4 OC12 LR/STM4 LH 1310 Card Specifications
- A.6.5 OC12 LR/STM4 LH 1550 Card Specifications
- A.6.6 OC12 IR/STM4 SH 1310-4 Card Specifications
- A.6.7 OC48 IR/STM16 SH AS 1310 Card Specifications
- A.6.8 OC48 LR/STM16 LH AS 1550 Card Specifications
- A.6.9 OC48 ELR/STM16 EH 100 GHz Card Specifications
- A.6.10 OC192 SR/STM64 IO 1310 Card Specifications
- A.6.11 OC192 IR/STM64 SH 1550 Card Specifications
- A.6.12 OC192 LR/STM64 LH 1550 Card Specifications
- A.6.13 OC192 LR/STM64 LH ITU 15xx.xx Card Specifications
- A.6.14 15454_MRC-12 Card Specifications
- A.6.15 OC192SR1/STM64IO Short Reach Card Specifications
- A.6.16 OC192/STM64 Any Reach Card Specifications
- A.7 Ethernet Card Specifications
- A.8 Storage Access Networking Card Specifications
- Administrative and Service States
- Network Element Defaults
- C.1 Network Element Defaults Description
- C.2 Card Default Settings
- C.2.1 Configuration Defaults
- C.2.2 Threshold Defaults
- C.2.3 Defaults by Card
- C.2.3.1 E1-N-14 Card Default Settings
- C.2.3.2 E1-42 Card Default Settings
- C.2.3.3 E3-12 Card Default Settings
- C.2.3.4 DS3i-N-12 Card Default Settings
- C.2.3.5 STM1E-12 Card Default Settings
- C.2.3.6 Ethernet Card Default Settings
- C.2.3.7 STM-1 Card Default Settings
- C.2.3.8 STM1-8 Card Default Settings
- C.2.3.9 STM-4 Card Default Settings
- C.2.3.10 STM4-4 Card Default Settings
- C.2.3.11 STM-16 Card Default Settings
- C.2.3.12 STM-64 Card Default Settings
- C.2.3.13 STM64-XFP Default Settings
- C.2.3.14 MRC-12 Card Default Settings
- C.2.3.15 FC_MR-4 Card Default Settings
- C.3 Node Default Settings
- C.4 CTC Default Settings
- Index

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Cisco ONS 15454 SDH Reference Manual, R7.0
October 2008
Chapter 12 SDH Topologies and Upgrades
12.4 Dual Ring Interconnect
12.4 Dual Ring Interconnect
Dual ring interconnect (DRI) topology provides an extra level of path protection for circuits on
interconnected rings. DRI allows users to interconnect MS-SPRings, SNCPs, or an SNCP with an
MS-SPRing, with additional protection provided at the transition nodes. In a DRI topology, ring
interconnections occur at two or four nodes.
The drop-and-continue DRI method is used for all ONS 15454 SDH DRIs. In drop-and-continue DRI, a
primary node drops the traffic to the connected ring and routes traffic to a secondary node within the
same ring. The secondary node also routes the traffic to the connected ring; that is, the traffic is dropped
at two different interconnection nodes to eliminate single points of failure. To route circuits on DRI, you
must choose the Dual Ring Interconnect option during circuit provisioning. Dual transmit is not
supported.
Two DRI topologies can be implemented on the ONS 15454 SDH:
• A traditional DRI requires two pairs of nodes to interconnect two networks. Each pair of
user-defined primary and secondary nodes drops traffic over a pair of interconnection links to the
other network.
• An integrated DRI requires one pair of nodes to interconnect two networks. The two interconnected
nodes replace the interconnection ring.
For DRI topologies, a hold-off timer sets the amount of time before a selector switch occurs. It reduces
the likelihood of multiple switches, such as:
• Both a service selector and a path selector
• Both a line switch and a path switch of a service selector
For example, if an SNCP DRI service selector switch does not restore traffic, then the path selector
switches after the hold-off time. The SNCP DRI hold-off timer default is 100 ms. You can change this
setting in the SNCP Selectors tab of the Edit Circuits window. For MS-SPRing DRI, if line switching
does not restore traffic, then the service selector switches. The hold-off time delays the recovery
provided by the service selector. The MS-SPRing DRI default hold-off time is 100 ms, but it can be
changed.
12.4.1 MS-SPRing DRI
Unlike MS-SPRing automatic protection switching (APS) protocol, MS-SPRing DRI is a path-level
protection protocol at the circuit level. Drop-and-continue MS-SPRing DRI requires a service selector
in the primary node for each circuit routing to the other ring. Service selectors monitor signal conditions
from dual feed sources and select the one that has the best signal quality. Same-side routing drops the
traffic at primary nodes set up on the same side of the connected rings, and opposite-side routing drops
the traffic at primary nodes set up on the opposite sides of the connected rings. For MS-SPRing DRI,
primary and secondary nodes cannot be the circuit source or destination.
Note A DRI circuit cannot be created if an intermediate node exists on the interconnecting link. However, an
intermediate node can be added on the interconnecting link after the DRI circuit is created.
DRI protection circuits act as protection channel access (PCA) circuits. In CTC, you set up DRI
protection circuits by selecting the PCA option when setting up primary and secondary nodes during DRI
circuit creation.