Manual

DS641F6 33
CS8421CS8421
6. PACKAGE DIMENSIONS
Notes:
1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold mismatch
and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be 0.13 mm total in
excess of “b” dimension at maximum material condition. Dambar intrusion shall not reduce dimension “b” by more
than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
TSSOP THERMAL CHARACTERISTICS
INCHES MILLIMETERS
NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.043 -- -- 1.10
A1 0.002 0.004 0.006 0.05 -- 0.15
A2 0.03346 0.0354 0.037 0.85 0.90 0.95
b 0.00748 0.0096 0.012 0.19 0.245 0.30 2,3
D 0.252 0.256 0.259 6.40 6.50 6.60 1
E 0.248 0.2519 0.256 6.30 6.40 6.50
E1 0.169 0.1732 0.177 4.30 4.40 4.50 1
e -- -- 0.026 -- -- 0.65
L 0.020 0.024 0.028 0.50 0.60 0.70
µ
0° 4° 8° 0° 4° 8°
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Parameter Symbol Min Typ Max Units
Junction to Ambient Thermal Impedance 2 Layer Board
4 Layer Board

JA
-
-
48
38
-
-
°C/Watt
°C/Watt
20L TSSOP (4.4 MM BODY) PACKAGE DRAWING
E
N
1
23
e
b
2
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW
