Owner manual

92 DS245F4
CS8420
18. PACKAGE DIMENSIONS
THERMAL CHARACTERISTICS AND SPECIFICATIONS
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.093 0.104 2.35 2.65
A1 0.004 0.012 0.10 0.30
B 0.013 0.020 0.33 0.51
C 0.009 0.013 0.23 0.32
D 0.697 0.713 17.70 18.10
E 0.291 0.299 7.40 7.60
e 0.040 0.060 1.02 1.52
H 0.394 0.419 10.00 10.65
L 0.016 0.050 0.40 1.27
∝
0° 8° 0° 8°
Parameter Symbol Min Typ Max Units
Junction to Ambient thermal impedance (28 pin SOIC) θJA - 65 - °C/W
Allowable Junction Temperature T
J
--135°C
28L SOIC (300 MIL BODY) PACKAGE DRAWING
D
HE
b
A1
A
c
L
∝
SEATING
PLANE
1
e