User Manual

66 DS992F1
CS53L30
10.2 QFN Package
10.2 QFN Package
Figure 10-2. 32-Pin QFN Package Drawing
1
11 Thermal Characteristics
12 Ordering Information
Dim
Millimeters
Min Nom Max
A— —1.00
A1 0.00 — 0.05
b 0.200.250.30
D 5.00 BSC
D2 3.55 3.65 3.75
E 5.00 BSC
E2 3.55 3.65 3.75
e 0.50 BSC
L 0.350.400.45
JEDEC #: MO–220
Controlling dimension is millimeters.
1. Dimensioning and tolerances per ASME Y 14.5M–1995.
2. Dimensioning lead width applies to the plated terminal and is measured between 0.20 and 0.25 mm from
the terminal tip.
Table 11-1. Thermal Characteristics
Parameters
1,2
1.Test printed circuit board assembly (PCBA) constructed in accordance with JEDEC standard JESD51–9. Two-signal, two-plane (2s2p) PCB used.
2.Test conducted with still air on a four-layer board in accordance with JEDEC standards, JESD51, JESD51–2A, and JESD51–8.
Symbol Min Typ Max Units
Junction-to-ambient thermal impedance WLCSP
QFN

JA
—
—
61
28
—
—
°C/W
°C/W
Junction-to-printed circuit board thermal impedance WLCSP
QFN

JB
—
—
10
15
—
—
°C/W
°C/W
Table 12-1. Ordering Information
Product Description Package Pb Free Grade Temp Range Container Order #
CS53L30 Low-Power Quad-Channel
Microphone ADC with TDM Output
30-ball WLCSP Yes Commercial –10°C to +70°C Tape and reel CS53L30-CWZR
32-pin QFN Yes Commercial –10°C to +70°C Tape and reel CS53L30-CNZR
Rail CS53L30-CNZ
b
A
A1
Pin #1 Corner
E
D2
Pin #1 Corner
E2
D
Top View Side View Bottom View
e
L