Manual

DS861PP3 37

CS5346

10.PACKAGE DIMENSIONS

11.THERMAL CHARACTERISTICS AND SPECIFICATIONS

1. 

is specified according to JEDEC specifications for multi-layer PCBs.

INCHES MILLIMETERS

DIM MIN NOM MAX MIN NOM MAX

A --- 0.055 0.063 --- 1.40 1.60

A1 0.002 0.004 0.006 0.05 0.10 0.15

B 0.007 0.009 0.011 0.17 0.22 0.27

D 0.343 0.354 0.366 8.70 9.0 BSC 9.30

D1 0.272 0.28 0.280 6.90 7.0 BSC 7.10

E 0.343 0.354 0.366 8.70 9.0 BSC 9.30

E1 0.272 0.28 0.280 6.90 7.0 BSC 7.10

e* 0.016 0.020 0.024 0.40 0.50 BSC 0.60

L 0.018 0.24 0.030 0.45 0.60 0.75



0.000° 4° 7.000° 0.00° 4° 7.00°

* Nominal pin pitch is 0.50 mm *Controlling dimension is mm. *JEDEC Designation: MS022

Parameters Symbol Min Typ Max Units

Package Thermal Resistance (Note 1) 48-LQFP



°C/Watt

Allowable Junction Temperature

--125

C

48L LQFP PACKAGE DRAWING

