User Manual

18 DS687F4
CS5343/4
Draft
2/1/11
7. PACKAGE DIMENSIONS
Notes:
1. Reference document: JEDEC MO-187
2. D does not include mold flash or protrusions, which is 0.15 mm max. per side.
3. E1 does not include inter-lead flash or protrusions, which is 0.15 mm max per side.
4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
5. Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
INCHES MILLIMETERS
NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.0433 -- -- 1.10
A1 0 -- 0.0059 0 -- 0.15
A2 0.0295 -- 0.0374 0.75 -- 0.95
b 0.0059 -- 0.0118 0.15 -- 0.30 4, 5
c 0.0031 -- 0.0091 0.08 -- 0.23
D -- 0.1181 BSC -- -- 3.00 BSC -- 2
E -- 0.1929 BSC -- -- 4.90 BSC --
E1 -- 0.1181 BSC -- -- 3.00 BSC -- 3
e -- 0.0197 BSC -- -- 0.50 BSC --
L 0.0157 0.0236 0.0315 0.40 0.60 0.80
L1 -- 0.0374 REF -- -- 0.95 REF --
µ0°--8°0°--8°
Controlling Dimension is Millimeters
Parameter Symbol Min Typ Max Unit
Allowable Junction Temperature T
J
--135
C
Junction to Ambient Thermal Impedance
(4-layer PCB)
(2-layer PCB)

JA-4

JA-2
-
-
100
170
-
-
C/W
C/W
10LD TSSOP (3 mm BODY) PACKAGE DRAWING (Note 1)
E
N
1
23
e
b
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW

L1
c