User guide

24 DS1057F1

6 Package Dimensions

Table 6-1. WLCSP Package Dimension

Symbol Description Dimensions

A Total thickness 0.495 ±0.04

S Wafer thickness 0.305 ±0.025

A1 Standoff 0.190 ±0.015

E Body size X 2

DY 2.25

SE Ball/bump pitch X 0.2 BSC

SD Y — BSC

E1 Edge ball center-to-center X 1.2 BSC

D1 Y 1.6 BSC

ePitch 0.4 BSC

Ball diameter 0.25

b Ball/bump width 0.216–0.324

n Ball/bump count 20

20-BALL WLCSP (2.25 mm x 2.0 mm Body) Package Drawing

A B C D