Manual

11 DS734F5
5.6 Switching Characteristics—RESET
5.6 Switching Characteristics—RESET
Figure 5-1. RESET Timing
5.7 Switching Characteristics—XTI
Figure 5-2. XTI Timing
5.8 Switching Characteristics—Internal Clock
Parameter Symbol Min Max Unit
RESET# minimum pulse width low T
rstl
1—ms
All bidirectional pins high-Z after RESET# low T
rst2z
— 100 ns
Configuration pins setup before RESET# high T
rstsu
50 — ns
Configuration pins hold after RESET# high T
rsthld
20 — ns
Parameter Symbol Min Max Unit
External Crystal operating frequency
1
1.Part characterized with the following crystal frequency values: 11.2896, 12.288, 18.432, 24.576, & 27 MH.z
F
xtal
11.2896 27 MHz
XTI period T
clki
33.3 100 ns
XTI high time T
clkih
13.3 — ns
XTI low time T
clkil
13.3 — ns
External Crystal Load Capacitance (parallel resonant)
2
2.C
L
refers to the total load capacitance as specified by the crystal manufacturer. Crystals that require a C
L
outside this range should be avoided. The
crystal oscillator circuit design should follow the crystal manufacturer’s recommendation for load capacitor selection.
C
L
10 18 pF
External Crystal Equivalent Series Resistance ESR — 50
Ω
Parameter Symbol Min Max Unit
Internal DCLK frequency
1
F
dclk
——MHz
CS4852x-CQZ
CS4854x-CQZ
CS4856x-CQZ
CS4854x-DQZ
CS4856x-DQZ
F
xtal
F
xtal
F
xtal
F
xtal
F
xtal
150
150
150
150
150
RESET#
T
rst2z
T
rstl
T
rstsu
T
rsthld
HS[3:0]
All Bidirectional
Pins
t
clkih
t
clkil
T
clki
XTI