User guide

CS4341
DS298F5 33
8.2 TSSOP
Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
9. PACKAGE THERMAL RESISTANCE
INCHES MILLIMETERS
NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.043 -- -- 1.10
A1 0.002 0.004 0.006 0.05 -- 0.15
A2 0.03346 0.0354 0.037 0.85 0.90 0.95
b 0.00748 0.0096 0.012 0.19 0.245 0.30 2,3
D 0.193 0.1969 0.201 4.90 5.00 5.10 1
E 0.248 0.2519 0.256 6.30 6.40 6.50
E1 0.169 0.1732 0.177 4.30 4.40 4.50 1
e -- 0.026 BSC -- -- 0.65 BSC --
L 0.020 0.024 0.028 0.50 0.60 0.70
∝
0° 4° 8° 0° 4° 8°
JEDEC #: MO-153
Controlling Dimension is Millimeters
Package Symbol Min Typ Max Units
SOIC
(for multi-layer boards)
TSSOP (for multi-layer boards)
θ
JA
θ
JA
-
-
74
89
-
-
°C/Watt
°C/Watt
16L TSSOP (4.4 mm BODY) PACKAGE DRAWING
E
N
1
23
e
b
2
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW
∝