User guide

7
CS42L73
3. THERMAL CHARACTERISTICS
Notes:
1. Test Printed Circuit Board Assembly (PCBA) constructed in accordance with JEDEC standard JESD51-9.
Two signal, two plane (2s2p) PCB utilized.
2. Test conducted with still air in accordance with JEDEC standards JESD51, JESD51-2A, and JESD51-8.
4. ORDERING INFORMATION
Parameter (Notes 1 and 2) Symbol Min Typ Max Units
WLCSP Package
Junction to Ambient Thermal Impedance θ
JA
-43 -°C/Watt
FBGA Package
Junction to Ambient Thermal Impedance θ
JA
-58 -°C/Watt
Product Description Package Pb-Free Grade
Temp
Range
Container Order #
CS42L73
Ultra Low Power Mobile
Audio and Telephony
CODEC
64 Ball
WLCSP
YES Commercial
-40
to
+85 °C
Tray CS42L73-CWZ
Tape & Reel CS42L73-CWZR
65 Ball
FBGA
Tray CS42L73-CRZ
Tape & Reel CS42L73-CRZR
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative.
To find one nearest you, go to www.cirrus.com.
IMPORTANT NOTICE
“Advance” product information describes products that are in development and subject to development changes. Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) be-
lieve that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS”
without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that
information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment,
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