Manual
Table Of Contents
- 1. Pin Descriptions
- 2. Characteristics and Specifications
- 3. Typical Connection Diagram
- 4. Detailed Block Diagram
- 5. Applications
- 5.1 General Description
- 5.2 System Design
- 5.3 Power-Up and Power-Down
- 5.4 Volume & Muting Control Architecture
- 5.5 Volume Controls
- 5.6 Muting Controls
- 5.7 Zero-Crossing Detection
- 5.8 System Serial Control Configuration
- 5.9 I·C/SPI Serial Control Formats
- 6. CS3318 Register Quick Reference
- 7. CS3318 Register Descriptions
- 7.1 Ch 1-8 Volume - Addresses 01h - 08h
- 7.2 ¹dB Control - Address 09h
- 7.3 Mute Control - Address 0Ah
- 7.4 Device Configuration 1 - Address 0Bh (Bit 5)
- 7.5 Device Configuration 2 - Address 0Ch
- 7.6 Channel Power - Address 0Dh
- 7.7 Master Power - Address 0Eh
- 7.8 Freeze Control - Address 0Fh
- 7.9 Master1 Mask - Address 10h
- 7.10 Master1 Volume - Address 11h
- 7.11 Master1 Control - Address 12h
- 7.12 Master2 Mask - Address 13h
- 7.13 Master2 Volume - Address 14h
- 7.14 Master2 Control - Address 15h
- 7.15 Master3 Mask - Address 16h
- 7.16 Master3 Volume - Address 17h
- 7.17 Master3 Control - Address 18h
- 7.18 Group2 Chip Address 19h
- 7.19 Group1 Chip Address 1Ah
- 7.20 Individual Chip Address 1Bh
- 7.21 Chip ID - Address 1Ch
- 8. Parameter Definitions
- 9. Package Dimensions
- 10. Thermal Characteristics and Specifications
- 11. Ordering Information
- 12. Revision History
DS693F1 43
CS3318
9. PACKAGE DIMENSIONS
10.THERMAL CHARACTERISTICS AND SPECIFICATIONS
1. θ
JA
is specified according to JEDEC specifications for multi-layer PCBs.
INCHES MILLIMETERS
DIM MIN NOM MAX MIN NOM MAX
A --- 0.055 0.063 --- 1.40 1.60
A1 0.002 0.004 0.006 0.05 0.10 0.15
B 0.007 0.009 0.011 0.17 0.22 0.27
D 0.343 0.354 0.366 8.70 9.0 BSC 9.30
D1 0.272 0.28 0.280 6.90 7.0 BSC 7.10
E 0.343 0.354 0.366 8.70 9.0 BSC 9.30
E1 0.272 0.28 0.280 6.90 7.0 BSC 7.10
e* 0.016 0.020 0.024 0.40 0.50 BSC 0.60
L 0.018 0.24 0.030 0.45 0.60 0.75
∝
0.000° 4° 7.000° 0.00° 4° 7.00°
* Nominal pin pitch is 0.50 mm *Controlling dimension is mm. *JEDEC Designation: MS022
Parameters Symbol Min Typ Max Units
Package Thermal Resistance (Note 1) 48-LQFP θ
JA
θ
JC
-
-
48
15
-
-
°C/Watt
°C/Watt
Allowable Junction Temperature - - 125
°C
48L LQFP PACKAGE DRAWING
E1
E
D1
D
1
e
B
L
∝
A1
A