Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
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PLSx3 Hardware Interface Description
4.2 Mounting PLSx3 onto the Application Platform
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PLSx3_HID_v01.002d 2021-08-24
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4.2.4.2 Processing Life
PLSx3 must be soldered to an application within 72 hours after opening the moisture barrier
bag (MBB) it was stored in.
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the
modules should have ambient temperatures below 30°C and a relative humidity below 60%.
4.2.4.3 Baking
Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 46 for details):
• It is
not necessary to bake PLSx3, if the conditions specified in Section 4.2.4.1 and Section
4.2.4.2 were not exceeded.
• It is
necessary to bake PLSx3, if any condition specified in Section 4.2.4.1 and Section
4.2.4.2 was exceeded.
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
4.2.4.4 Electrostatic Discharge
Electrostatic discharge (ESD) may lead to irreversable damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 3.6 for further information on electrostatic discharge.