Specifications

CINTERION

BGS12 Hardware Interface Description

Contents

95 of 109

Page

BGS12 HID_V00.915

Confidential / Released

2019

6.2.4.2

Processing Life

BGS12 must be soldered to an application within 72 hours after opening the MBB (=mois-

ture barrier bag) it was stored in.

As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the

modules should have ambient temperatures below 30°C and a relative humidity below 60%.

6.2.4.3

Baking

Baking conditions are specified on the moisture sensitivity label attached to each MBB (see

Figure 55 for details):

•

It is not necessary to bake BGS12, if the conditions specified in Section 6.2.4.1 and Sec-

tion 6.2.4.2 were not exceeded.

•

It is necessary to bake BGS12, if any condition specified in Section 6.2.4.1 and Section

6.2.4.2 was exceeded.

If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.

Devices should not be baked in tape and reel carriers at any temperature.

6.2.4.4

Electrostatic Discharge

ESD (=electrostatic discharge) may lead to irreversable damage for the module. It is therefore

advisable to develop measures and methods to counter ESD and to use these to control the

electrostatic environment at manufacturing sites.

Please refer to Section 5.8 for further information on electrostatic discharge.

6.3 Packaging

6.3.1 Tape and Reel

The single-feed tape carrier for BGS12 is illustrated in Figure 53. The figure also shows the

proper part orientation. The tape width is 44 mm and the BGS12 modules are placed on the

tape with a 28-mm pitch. The reels are 330 mm in diameter with a core diameter of 180 mm.

Each reel contains 500 modules.