Specifications

CINTERION
®
BGS12 Hardware Interface Description
Contents
93 of 109
Page
BGS12 HID_V00.915
Confidential / Released
2019
-
01
-
07
6.2.3 Soldering Conditions and Temperature
6.2.3.1
Reflow Profile
Figure 52: Reflow Profile
Table 35: Reflow temperature ratings
Profile Feature Pb-Free Assembly
Initial temperature (T
I
)
Average temperature slope (T
I
to T
Smin
)
25 °C
0.5-2.0 °C /second
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
210°C
90-120 seconds
Average ramp up rate (T
Smax
to T
P
)
3K/second max.
Liquidous temperature (T
L1
)
Time at liquidous (t
R
)
217°C
30-90 seconds
Peak package body temperature (T
P
)
245°C +0/-5°C
Time (t
P
) within 5 °C of the peak package
body temperature (T
P
)
30 seconds max.
Average ramp-down rate (T
P
to T
Smax
)
6K/second max.
Time of cold-down (T
P
to T
L2
)
0-60 seconds
Time TI to maximum (T
I
to T
P
)
8 min max.