Specifications

CINTERION
®
BGS12 Hardware Interface Description
Contents
91 of 109
Page
BGS12 HID_V00.915
Confidential / Released
2019
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01
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Note that depending on coplanarity or other properties of the external PCB, it could be that all
of the central ground pads may have to be soldered.
Figure 50: Recommended design for 120 micron thick stencil (top view)
Figure 51: Recommended design for 150 micron thick stencil (top view)