Specifications

CINTERION
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BGS12 Hardware Interface Description
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BGS12 HID_V00.915
Confidential / Released
2019
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See also Section 3.3.5.1 for information about the NTC for on-board temperature measure-
ment, automatic thermal shutdown and alert messages.
Note that within the specified operating temperature ranges the board temperature may vary
to a great extent depending on operating mode, used frequency band, radio output power and
current supply voltage.
5.3 Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 19: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10 - 20 Hz
Acceleration: 5g;
Frequency range: 20 - 500 Hz
Acceleration: 5g; Duration:20h
per axis; 3 axes
Shock half-sinus
Acceleration: 25g
Shock duration:
6msec
5 shock per axis
6 positions(±x, y and z)
Dry heat
Temperature: +70
±2°C Test duration:
16h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb
ETS 300 019-2-7
Temperature
change
(shock)
Low temperature: -40°C ±2°C
High temperature:+85 ℃±
2°C
Changeover time:< 30s(dual chamber
system)
Test duration: 1h
Number of repetitions: 24
Damp heat
cyclic
High temperature: +55°C
±2°C
Low temperature: +25°C
±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 60068-2-30 Db
ETS 300 019-2-5
Cold (constant
exposure)
Temperature: -40 ±2°C
Test duration: 16h
DIN IEC 60068-2-1