Specifications

CINTERION
®
BGS12 Hardware Interface Description
Contents
6 of 109 Page
BGS12 HID_V00.
915
Confidential / Released
2019
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01
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07
Tables
Table 1: Directives ............................................................................................................. 12
Table 2: Standards of European type approval .................................................................. 13
Table 3: Requirements of quality........................................................................................ 13
Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China14
Table 5: Toxic or hazardous substances or elements with defined concentration limits ..... 14
Table 6: Overview of operating modes ............................................................................... 24
Table 7: Signal states ........................................................................................................ 31
Table 8: Temperature dependent behavior ........................................................................ 34
Table 9: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes ............................ 39
Table 10: State transitions of BGS12 (except SLEEP mode) ............................................. 40
Table 11: Signals of the SIM interface (SMT application interface) .................................... 41
Table 12: DCE-DTE wiring of ASC0 ................................................................................... 44
Table 13: DCE-DTE wiring of ASC1 ................................................................................... 46
Table 14: DCE-DTE wiring of ASC2 ................................................................................... 48
Table 15: GPIO assignment .............................................................................................. 52
Table 16: Return loss in the active band ............................................................................ 62
Table 17: Absolute maximum ratings ................................................................................. 69
Table 18: Board temperature ............................................................................................. 69
Table 19: Summary of reliability test conditions ................................................................. 70
Table 20: Pad assignments ................................................................................................ 72
Table 21: Electrical description of application interface ...................................................... 73
Table 22: Electrical description of application interface ...................................................... 75
Table 23: Electrical description of application interface ...................................................... 76
Table 24: Electrical description of application interface ...................................................... 76
Table 25: Electrical description of application interface ...................................................... 77
Table 26: Electrical description of application interface ...................................................... 78
Table 27: Power supply ratings
1
......................................................................................... 79
Table 28:Power supply ratings
1
.......................................................................................... 80
Table 29: Audio parameters adjustable by AT command ................................................... 81
Table 30: Voiceband characteristics (typical) ..................................................................... 83
Table 31: Voiceband receive path ...................................................................................... 84
Table 32: Voiceband transmit path ..................................................................................... 85
Table 33: Antenna interface specifications ......................................................................... 86
Table 34: Measured electrostatic values ............................................................................ 87
Table 35: Reflow temperature ratings ................................................................................ 93
Table 36: Storage conditions ............................................................................................. 94
Table 37: EMI measures on the application interface ....................................................... 103
Table 38: List of parts and accessories ............................................................................ 105
Table 39: Molex sales contacts (subject to change) ......................................................... 106
Table 40: Manufacturer address DBG Holdings Limited ................................................... 106