Specifications

CINTERION
®
BGS12 Hardware Interface Description
Contents
5 of 109 Page
BGS12 HID_V00.
915
Confidential / Released
2019
-
01
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07
6.2.1 SMT PCB Assembly............................................................................................ 90
6.2.1.1
Land Pattern and Stencil ........................................................................ 90
6.2.1.2
Board Level Characterization ................................................................. 92
6.2.2 Moisture Sensitivity Level .................................................................................... 92
6.2.3 Soldering Conditions and Temperature ................................................................ 93
6.2.3.1
Reflow Profile ......................................................................................... 93
6.2.3.2
Maximum Temperature and Duration ..................................................... 94
6.2.4 Durability and Mechanical Handling ..................................................................... 94
6.2.4.1
Storage Conditions ................................................................................. 94
6.2.4.2
Processing Life ....................................................................................... 95
6.2.4.3
Baking .................................................................................................... 95
6.2.4.4
Electrostatic Discharge ........................................................................... 95
6.3 Packaging ........................................................................................................... 95
6.3.1 Tape and Reel ..................................................................................................... 95
6.3.1.1 Orientation ............................................................................................. 96
6.3.2 Shipping Materials............................................................................................... 97
6.3.2.1
Moisture Barrier Bag .............................................................................. 97
6.3.2.2
Transportation Box ................................................................................. 99
7 Sample Application ..................................................................................................... 100
7.1 Blocking against RF on Interface Lines .................................................................... 102
8 Reference Approval ..................................................................................................... 104
8.1 Reference Equipment for Type Approval ................................................................. 104
9 Appendix ...................................................................................................................... 105
9.1 List of Parts and Accessories ................................................................................... 105
9.2 FCC statement ........................................................................................................ 107