Specifications

Cinterion
®
ELS81-US Hardware Interface Description
4.2 Mounting ELS81-US onto the Application Platform
92
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els81-us_hid_v01.004 2017-09-27
Confidential / Preliminary
Page 84 of 107
4.2.3.2 Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 30 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
ELS81-US is specified for one soldering cycle only. Once ELS81-US is removed from the ap-
plication, the module will very likely be destroyed and cannot be soldered onto another appli-
cation.
Table 18: Reflow temperature ratings
1
1. Please note that the reflow profile features and ratings listed above are based on the joint industry standard
IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on reflow
profiles and their optimization please refer to [3].
Profile Feature Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
L
to T
P
) 3K/second max.
2
2. Temperatures measured on shielding at each corner. See also [3].
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
50-90 seconds
Peak package body temperature (T
P
)245°C +0/-5°C
Time (t
P
) within 5 °C of the peak package body tem-
perature (T
P
)
30 seconds max.
Average ramp-down rate 3 K/second max.
2
Time 25°C to maximum temperature 8 minutes max.
1
4
2
3
Module
Temperature sensors (1-4)