Specifications

Table Of Contents
Cinterion
®
ELS81-US Hardware Interface Description
4.2 Mounting ELS81-US onto the Application Platform
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els81-us_hid_v01.004 2017-09-27
Confidential / Preliminary
Page 83 of 107
4.2.3 Soldering Conditions and Temperature
4.2.3.1 Reflow Profile
Figure 47: Reflow Profile
T
L
T
P
t
P
t
L
t
S
Preheat
t to maximum
Time
Temperature
T
Smin
T
Smax