Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 Inter-Integrated Circuit Interface
- 2.1.7 UICC/SIM/USIM Interface
- 2.1.8 Enhanced ESD Protection for SIM Interfaces
- 2.1.9 Digital Audio Interface
- 2.1.10 Analog-to-Digital Converter (ADC)
- 2.1.11 RTC Backup
- 2.1.12 GPIO Interface
- 2.1.13 Control Signals
- 2.1.14 JTAG Interface
- 2.1.15 eMMC Interface
- 2.2 GSM/UMTS/LTE Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 2.1 Application Interface
- 3 GNSS Interface
- 4 Operating Characteristics
- 5 Mechanical Dimensions and Mounting
- 6 Regulatory and Type Approval Information
- 7 Document Information
- 8 Appendix
Cinterion
®
ALAS5V Hardware Interface Description
1.2 Key Features at a Glance
16
ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 9 of 124
1.2 Key Features at a Glance
Feature Implementation
General
Frequency bands Note: Not all of the frequency bands (and 3GPP technologies) mentioned
throughout this document are supported by every
ALAS5V product vari-
ant. Please refer to Section 1.2.1 for an overview of the frequency bands
supported by each
ALAS5V product variant.
GSM class Small MS
Output power
(according to Release 99)
GSM/GPRS/UMTS:
Class 4 (+33dBm ±2dB) for EGSM850 and EGSM900
Class 1 (+30dBm ±2dB) for GSM1800 and GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK and GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK and GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for all supported WCDMA FDD bands
Output power
(according to Release 4)
TD-SCDMA:
Class 2 (+24dBm +1/-3dB) for TD-SCDMA 1900 (Bd39) and TD-SCDMA
2000 (Bd34)
Output power
(according to Release 8)
LTE (FDD):
Class 3 (+23dBm ±2dB) for all supported LTE FDD bands
LTE (TDD):
Class 3 (+23dBm ±2dB) for all supported LTE TDD bands
Power supply 3.3V <
V
BATT+
< 4.2V
Operating temperature
(board temperature)
Normal operation: -30°C to +85°C
Restricted operation: -40°C to +95°C
Physical Dimensions: 40mm x 36mm x 3mm
Weight: 8.8g
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 13 Down- and Uplink carrier aggregation (CA) to increase bandwidth, and
thereby increase bitrate:
• Maximum aggregated bandwidth: 80MHz
• Maximum number of component carriers: 2
• Inter-band FDD
• Intra-band FDD, TDD, contiguous, non-contiguous
• Supported inter- and intra-band CA configurations: See Section 1.2.2
CAT 6 supported
DL 300Mbps, UL 50Mbps
2x2 MIMO in DL direction
HSPA features
3GPP Release 8 UE CAT. 14, 24
DC-HSPA+ – DL 42Mbps
HSUPA – UL 5.76Mbps
Compressed mode (CM) supported according to 3GPP TS25.212