Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 Inter-Integrated Circuit Interface
- 2.1.7 UICC/SIM/USIM Interface
- 2.1.8 Enhanced ESD Protection for SIM Interfaces
- 2.1.9 Digital Audio Interface
- 2.1.10 Analog-to-Digital Converter (ADC)
- 2.1.11 RTC Backup
- 2.1.12 GPIO Interface
- 2.1.13 Control Signals
- 2.1.14 JTAG Interface
- 2.1.15 eMMC Interface
- 2.2 GSM/UMTS/LTE Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 2.1 Application Interface
- 3 GNSS Interface
- 4 Operating Characteristics
- 5 Mechanical Dimensions and Mounting
- 6 Regulatory and Type Approval Information
- 7 Document Information
- 8 Appendix
Cinterion
®
ALAS5V Hardware Interface Description
2.1 Application Interface
67
ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 19 of 124
Figure 3: ALAS5V bottom view: Pad assignments
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
T
GND rfu
(dnu)
rfu
(dnu)
FwSwap TXD2 GPIO15 RXD2 GND
PCIE_
RX_P
PCIE_
RX_N
GND
PCIE_
TX_P
PCIE_
TX_N
GND GND
R
PWR_
IND
RTS1 CTS1 TXD1 RXD1 PCIE_
HOST_
WAKE
PCIE_
HOST_
RST
GND GND PCIE_
CLK_
REQ
GND GND GPIO16
(Interrupt)
P
GND BATT+_
RF
BATT+_
RF
GPIO5
(Inter-
rupt)
rfu
(DIN1)
rfu
(DOUT1)
rfu
(BCLK1)
rfu
(FSC1)
MCLK
EMMC_
D7
EMMC_
CMD
EMMC_
D3
EMMC_
CLK
PCIE_-
CLK_P
PCIE_
CLK_N
VUSB_
IN
GND
N
GND GND GND GND FSC2 DOUT2 DIN2 BCLK2 GND
EMMC_
D4
EMMC_
D5
EMMC_
D2
EMMC_
D0
GND GND CCIN2 CCIN1 GND
M
GND GND GND GND GND GPIO17 JTAG_
WD_
DISABLE
I2CDAT1 I2CCLK1 rfu
(dnu)
rfu
(dnu)
EMMC_
D6
EMMC_
D1
GPIO22 USB_DP USB_DN CCCLK2 CCCLK1 GPIO8
(Interrupt)
L
ANT_
MAIN
GND GND GND rfu
(dnu)
EMMC_
DETECT
rfu
(nc)
rfu
(nc)
EMMC_
PWR
GND GND CCVCC2 CCRST1 GPIO4
K
GND GND GND GND rfu
(dnu)
USB_
SSRX_P
USB_
SSRX_N
CCRST2 CCVCC1 rfu
(dnu)
J
GND GND GND GND rfu
(dnu)
GND GND CCIO2 CCIO1 RING0
H
GND GND GND GND GND
USB_
SSTX_P
USB_
SSTX_N
GPIO6
(Inter-
rupt)
TXD0 rfu
(BATT_
ID)
G
GND GND GND GND rfu
(dnu)
GND GND DCD0 /
Down-
load
CTS0 RTS0
F
ANT_
DRX_
MIMO
GND GND GND rfu
(dnu)
rfu
(dnu)
rfu
(nc)
rfu
(nc)
GND EMERG
_OFF
DSR0 RXD0 DTR0 BATT+
E
GND GND GND GND GND rfu
(dnu)
GPIO1 /
DR_SYNC
GPIO7
(Inter-
rupt)
GPIO14 GPIO13 GPIO12 JTAG_
PS_
HOLD
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
VEXT rfu
(dnu)
BATT+
D
GND GND GND GND rfu
(dnu)
ADC4_IN ADC5_IN ADC1_
IN
ADC2_
IN
GPIO11 GNSS_
EN
JTAG_
TMS
JTAG_
TRST
JTAG_
TDI
JTAG_
SRST
JTAG_
TDO
IGT
C
GND GND GND GND GND GND GND GND GND GND GND GND GND GND GPIO3
(Interrupt)
JTAG_
TCK
GND
B
rfu
(dnu)
GND GND GND GND GND GND GND GND GND GND GND GND GND
rfu
(dnu)
A
GND GND GND
rfu
(dnu)
GND GND GND
rfu
(dnu)
GND GND GND
ANT_
GNSS
GND ANT_
GNSS_
DC
GND
rfu: Reserved for future use (may be connected to external application
(nc): Internally not connected (may be arbitrarily connected to external GND)
(dnu): Do not use (should not be connected to external application)
Circle marks round shaped pads designed for improved impedance.
Orange: Keep out areas on external application’s PCB.
Round shaped: No solder pads, should therefore not be soldered. No fur-
ther tracks on PCB’s first layer.