Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 Inter-Integrated Circuit Interface
- 2.1.7 UICC/SIM/USIM Interface
- 2.1.8 Enhanced ESD Protection for SIM Interfaces
- 2.1.9 Digital Audio Interface
- 2.1.10 Analog-to-Digital Converter (ADC)
- 2.1.11 RTC Backup
- 2.1.12 GPIO Interface
- 2.1.13 Control Signals
- 2.1.14 JTAG Interface
- 2.1.15 eMMC Interface
- 2.2 GSM/UMTS/LTE Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 2.1 Application Interface
- 3 GNSS Interface
- 4 Operating Characteristics
- 5 Mechanical Dimensions and Mounting
- 6 Regulatory and Type Approval Information
- 7 Document Information
- 8 Appendix
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ALAS5V Hardware Interface Description
5.2 Mounting ALAS5V onto the Application Platform
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ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 100 of 124
The stencil design illustrated in Figure 43 is recommended by Gemalto M2M as a result of ex-
tensive tests with Gemalto M2M Daisy Chain modules.
Figure 43: Recommended design for 110 micron thick stencil (top layer)
5.2.1.2 Board Level Characterization
Board level characterization issues should also be taken into account if devising an SMT pro-
cess.
It is recommended to characterize land patterns before an actual PCB production, taking indi-
vidual processes, materials, equipment, stencil design, and reflow profile into account. For land
and stencil pattern design recommendations see also Section 5.2.1.1. Optimizing the solder
stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-
der voids, and to increase board level reliability.
Daisy chain modules for SMT characterization are available on request. For details refer to [3].
Generally, solder paste manufacturer recommendations for screen printing process parame-
ters and reflow profile conditions should be followed. Maximum ratings are described in Section
5.2.3.
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