User's Manual
Table Of Contents
- General
- Module introduction
- Hardware description
- Approvals
- CE Approvals (ETSI)
- FCC Approvals
- ATEX Approvals
- Module Pinout
- Hardware Description
- Hardware Diagram
- Interface characteristics
- Absolute Maximum Ratings
- Environmental characteristics
- Recommended operating conditions
- DC Electrical Characteristics
- Digital IO Specifications
- AC Electrical Characteristics
- Physical Dimensions and Footprint
- Physical Dimensions
- Recommended Footprint
- Soldering Temperature Time Profile (for reflow so
- Recommended temperature time profile for lead-fre
- Reliability Test
- Application Precautions
- Safety precautions
- Engineering design and using precautions
- Storage conditions
- Packaging
- Carrier tape
- Reel
- Ordering Information
- Drawing of Product Label
- Disclaimer
- RoHS Declaration
- Data Sheet Status
- Reference Documents
- Contact Information
SZU06A1 Product Manual
SZU06A1 PM(Rev 2.0)
20
The environment of direct sunshine, outdoor or dusty environment
Environment easy to condensation
Environment with high concentration and harmful gases (such as air with salt, muriatic
acid, chlorine, sulfur dioxide, sulfuretted hydrogen, ammonia gas or nitrogen oxide)
（5）Mechanical stress shall be avoided in assembly or operation of SZU06A1.
（6）Do not press the shielding cover or tighten the objects to the shielding cover
（7）When the SZU06A1 is working, the safe distance between it and human body must be
greater than 20 centimeters.
12.3 Storage conditions
(1) SZU06A1 must not be stressed mechanically during storage
(2) Performance characteristics of the module shall not be evaluated under the following
environment and the storage under this environment may have a large impact on the
performance of SZU06A1 (such as RF performance).
Salty air or environment with high concentration corrosive gases (such as
Cl2,H2S,NH3,SO2,OR NOx )
Storage in direct sunshine
Storage in an environment where air humidity exceeds 85%
(3) After the above-mentioned conditions are satisfied, the storage time of the module during
assembly of final products shall not exceed two years.