User's Manual
Table Of Contents
- General
- Module introduction
- Hardware description
- Approvals
- CE Approvals (ETSI)
- FCC Approvals
- ATEX Approvals
- Module Pinout
- Hardware Description
- Hardware Diagram
- Interface characteristics
- Absolute Maximum Ratings
- Environmental characteristics
- Recommended operating conditions
- DC Electrical Characteristics
- Digital IO Specifications
- AC Electrical Characteristics
- Physical Dimensions and Footprint
- Physical Dimensions
- Recommended Footprint
- Soldering Temperature Time Profile (for reflow so
- Recommended temperature time profile for lead-fre
- Reliability Test
- Application Precautions
- Safety precautions
- Engineering design and using precautions
- Storage conditions
- Packaging
- Carrier tape
- Reel
- Ordering Information
- Drawing of Product Label
- Disclaimer
- RoHS Declaration
- Data Sheet Status
- Reference Documents
- Contact Information
SZU06C2 Product Manual
SZU06C2 PM(Rev 2.0)
Table of Contents
Table of Contents....................................................................................................................................................... 1
1 General.................................................................................................................................................................... 1
1.1 Module introduction....................................................................................................................................... 1
1.2 Hardware description......................................................................................................................................1
2 Approvals.................................................................................................................................................................2
2.1 CE Approvals (ETSI).................................................................................................................................... 2
2.2 FCC Approvals..............................................................................................................................................3
2.3 ATEX Approvals............................................................................................................................................5
3 Module Pinout.......................................................................................................................................................7
4 Hardware Description............................................................................................................................................ 9
4.1 Hardware Diagram.......................................................................................................................................9
4.2 Interface characteristics.............................................................................................................................10
5 Absolute Maximum Ratings................................................................................................................................11
5.1 Environmental characteristics.......................................................................................................................11
5.2 Recommended operating conditions............................................................................................................ 12
6 DC Electrical Characteristics..........................................................................................................................12
7 Digital IO Specifications...................................................................................................................................13
8 AC Electrical Characteristics..........................................................................................................................14
9 Physical Dimensions and Footprint............................................................................................................. 16
9.1 Physical Dimensions................................................................................................................................... 16
9.2 Recommended Footprint............................................................................................................................17
10 Soldering Temperature Time Profile (for reflow soldering)................................................................. 18
10.1 Recommended temperature time profile for lead-free solder..............................................................18
11 Reliability Test..................................................................................................................................................... 19
12 Application Precautions.................................................................................................................................20
12.1 Safety precautions.....................................................................................................................................20
12.2 Engineering design and using precautions.............................................................................................20