Brochure

Chem-Wik
®
Rosin
The fast, safe rosin flux desoldering braid for
removing solder from leads and components
■
Coated with ultra high purity rosin
■
Quickly and thoroughly removes solder
■
Noncorrosive Type R rosin flux
Chem-Wik
®
Rosin Gray .030"/0.8mm 2-25L 2-50L 2-100L 2-500L Micro-Circuits
Yellow .050"/1.3mm 5-25L 5-50L 5-100L 5-500L Small Pads
Green .075"/1.9mm 7-25L 7-50L 7-100L 7-500L Medium Pads
Blue .100"/2.5mm 10-25L 10-50L 10-100L 10-500L Large Pads
Chem-Wik
®
Rosin SD Gray .030"/0.8mm 2-5L Micro-Circuits
Yellow .050"/1.3mm 5-5L Small Pads
Green .075"/1.9mm 7-5L Medium Pads
Blue .100"/2.5mm 10-5L Large Pads
Chem-Wik
®
Rosin SD
The fast, safe rosin flux desoldering braid
packaged in static dissipative bobbins
■
Reduces the risk of damage associated with
static electricity
■
Coated with noncorrosive ultra high purity Type
R rosin flux
■
Quickly and thoroughly removes solder
Chem-Wik
®
Desoldering Braid
As the standard desoldering braid for service and repair, Chem-Wik
®
Desoldering Braid ensures fast and safe desoldering.
The ultra-pure, oxygen free copper braid quickly and completely removes solder from circuit boards and components. Its fast
wicking action protects components from harmful heat damage. PermaPak
™
Barrier Packaging ensures ultimate braid
freshness and speed by sealing out harmful effects of the environment and protecting against oxidation.
PermaPak
™
Barrier Packaging
contains 25 bobbins per package
The Leader in
DDeessoollddeerriinngg TTeecchhnnoollooggyy
Chem-Wik
®
Desoldering Braid
Desoldering Applications
Cleaning Applications
Braid Sizes
Wire Wrap Pins
Desolder pins for easy removal. Removes solder buildup. Eliminates
potential intermittent problems.
Lugs/Posts
Wicks solder completely,
eliminating solder splash or
drip. Leaves terminal fluxed
and ready for resoldering.
Components
Easily removes solder from
components with straight or
clinched leads. Minimum
heat required. No damage
to board or components.
SMT Pads
Quickly and safely desolders
entire rows of SMT pads.
Applications-specific sizes
desolder individual fine-pitch
SMT pads.
BGA Pads
Safely removes solder from
BGA pads and chips in three
to four passes. Completely
removes all residual solder
and facilitates chip
repositioning.
Solder Bridges
Completely removes solder
bridges. Eliminates potential
shorts. No damage to
boards or circuitry.
Clean Script
Selectively retouches etched
script. Improves aesthetic
appearance. Eliminates
secondary identification.
Easy to use.
Blobs
Eliminates and removes
blobs as well as shorts and
icicles. Leaves circuitry
smooth. Cleans potential
problem areas.
Finger Connectors
Cleans finger connectors
and surface mount pads.
BGA Purple
.030”/0.8mm White
.060/”1.5mm Yellow
.080”/2.0mm Green
.110”/2.8mm Blue
.145”/3.7mm Brown
.210”/5.3mm Red
Chem-Wik
®
Desoldering Braid:
Meets or exceeds the greatest range of perfomance standards:
■
MIL-F-14256F Type R
■
NASA STD-8739.3 Soldered Electrical Connections
■
ANSI/IPC J STD-004, Type ROL0
Static Dissipative Packaging:
■
DOD Standard 1686C and MIL-HDBK-263B
■
Mil-Std-2000A
■
Mil-B-81705C Static Decay Rate Provision
Chem-Wik
®
Product Selection Guide
5' 25' 50' 100' 500'
PRODUCT COLOR SIZE 1.5m 7.5m 15.0m 30.5m 152.5m APPLICATION
Distributed by:
Soder-Wick
®
, Chem-Wik
®
and Chemtronics
®
are registered trademarks of ITW Chemtronics
®
.
VacuPak
™
,Performance Pak
™
and PermaPak
™
are trademarks of ITW Chemtronics
®
. ©2005 ITW Chemtronics
®
all rights reserved SW CAT 0010.02 Rev. 5026 5M
ITW Chemtronics
8125 Cobb Center Drive
Kennesaw, GA 30152-4386
770-424-4888 • 1-800-645-5244
Fax: [phone] • 1-800-243-6003
www.chemtronics.com