Operating instructions
Quarterly Maintenance
Copyright © 2012 EVG 131
6
6
Afterwards the apply button has to be clicked for saving the new
adjustment. This will not work if a process is running. In this case there
will be a message that the IO service has to be restarted to apply the
adjustment.
These adjustments can only be done by administrators.
6.4 TC Wafer Test
1) Clean bond chuck, pressure disc and TC wafer with IPA
2) Remove the wafer bow pin (if equipped)
3) Load a bond chuck with TC wafer into the chamber
4) Connect TC Wafer with data logger.
5) Close chamber
6) Piston Down with low force (1000N)
7) Heat chamber to 100°C, 200°C, 300°C, 400°C, 500°C with both
heaters. Wait 180sec until the setpoint is reached and calculate the
temperature uniformity with the formula: (max-min) / (2 x
average)
Figure 132 - TC Wafer Test
Note: For the temperature uniformity specification refer to the Acceptance Test
Protocol.
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