Operating instructions

Monthly Maintenance

5.17.3 Cooling Time

Check the Cooling Time of the system.

1) Load bond chuck with wafer into chamber

2) Close chamber

3) Evacuate till 5mbar

4) Fill chamber with N2

5) Piston Down with low force (appr.1000N)

6) Heat chamber till 400°C with both heaters if the max. temperature

of the system is 550°C. If the temperature of the system is limited

<400°C use the max. temperature limit for this test, i.e.: 200°C,

250°C.

7) Wait 5min

8) Activate top (if equipped) - and bottom side cooling

9) Test ends when temperature reaches 100°C on both heaters

according to chamber TCs.

Note: For the Cooling Time refer to the Cooling Performance Specification

according to the Acceptance Test Protocol.

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