Operating instructions

Process Flow for the De-embossing

1 Process Flow for the De-embossing

1) Load substrate to Bond Chuck.

2) Insert separation flags (if equipped).

3) Load stamp to Bond Chuck.

4) Load stamp holder and clamp substrate and stamp  if optically

alignment is required step 1 to 3 will be done in the EVG6xx

aligner.

5) Load bond chuck into bond chamber and start process.

De-embossing process flow:

1) Unload bond chuck and load onto cooling station (let the bond

chuck cool down).

2) Connect vacuum tubes and turn on vacuum to fix substrate on

bond chuck and stamp on stamp holder.

3) Unclamp stamp holder and use the 3 screws to de-emboss

(separate) stamp from substrate.

4) Use handling tool for stamp holder to unload the stamp holder.

5) Turn off substrate vacuum and unload substrate.

6) Load next substrate for the next process or turn off stamp vacuum

and unload stamp.

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