Operating instructions

Weekly Maintenance

Figure 60 - Pressure Film Test Result

Place the bond chuck in the chamber and apply a piston force

according to the table below. After 30sec of delay release the piston

force and remove the tool from chamber. Unclamp the substrate

manually and remove the top wafer + top pressure film carefully. You

can see the result of the pressure film test on the bottom pressure film.

Required Contact Force for Pressure Film 28 – 85PSI (19,31 –

58,61N/cm²)

Wafersize 100mm 150mm 200mm 300mm

min. Contact Force 1525N 3400 6060 13650

max. Contact Force 4600N 10400 18500 41600

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