Operating instructions

Weekly Maintenance

Maximum stack height measurement:

1) 20/40kN systems (cylinder diam. 100mm)

• SAP# 10032562 (with wafer bow unit)

• SAP# 10032368 (without wafer bow unit)

With wafer bow unit:

Set stack thickness to 20mm and apply “wafer bow” using the Low

Level functions (clear “piston up” before).

Then apply caliper as shown in the figure below, set to “0” and execute

“piston down” (empty bondchuck loaded in the chamber) and check

stroke. Typically, the stroke will be in the 18 +/- 1mm range.

Figure 46 - Apply Caliper

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