Operating instructions

Daily Maintenance

• Insert the Measurement plate between the Flag and the Bondchuck:

Figure 17 - Insert Measurement Plate

1 Measurement plate

2 Flag

Lift off between measurement plate and flag should be reached at a

clamping force of: see next chapter

3.7.7 Clamping Force

The appropriate clamping force range depends on the wafers that are

clamped. The following table gives a guideline. Any deviation from

standard wafers (non-Si wafers, special shape of the wafer edge,

thinner wafers, defective edge…) requires an investigation of the

appropriate clamping force.

Bondchuck/Wafer inch Clamp force [N]

6” Si wafer; standard thickness 8 - 12 N

8” Si wafer; standard thickness 8 - 12 N

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