Operating instructions

Preventive Maintenance Manual
14 Copyright © 2012 EVG
c) Bond tool insert thickness = measured value – wafer thickness
e.g. measured value 9,2mm; wafer thickness 500 μm
9,2 mm – 2 x 500 μm = 8,2 mm bond tool insert thickness
d) Repeat the measurements on these points
Figure 7
e) Repeat this measurement procedure on all bond tools
f) All measured points should have the same value
If there is one “bad” measurement point, we recommend sending back
the bond tool for further analyses at EV Group.
120°
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