Operating instructions

Daily Maintenance

3.4.1 Bond Tool Insert

The bond tool insert should have the same thickness (8mm) all over the

surface.

Required tools:

• Sliding caliper

• Wafer pieces with defined thickness (e.g. 500 μm)

a) Put the wafer pieces on the top and bottom side of the pressure

insert. The bond tool frame is probably higher than the bond

tool insert. This is the reason why we need the wafer pieces.

b) Take the sliding caliper and measure the whole stack

thickness.

Figure 6 - Sliding Caliper

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