Operating instructions

Preventive Maintenance Manual
4 Copyright © 2012 EVG
6.4 TC Wafer Test .............................................................. 131
7 Annual Inspection ................................................................. 132
7.1 Cooling Fluid................................................................. 132
7.2 Cooling Lines ................................................................ 133
7.3 Cleaning Procedure ...................................................... 135
7.4 Vacuum Pump .............................................................. 135
7.5 Vacuum Gauges ........................................................... 135
7.6 Heater Cooling.............................................................. 135
7.7 Waterlines..................................................................... 135
7.8 Turbo pump .................................................................. 135
7.9 Wafer bow Contact of the Piston .................................. 136
8 Troubleshooting.................................................................... 137
8.1 Bonder doesn’t heat...................................................... 137
8.2 Bonder doesn’t reach end temperature......................... 138
8.3 Endvacuum not reached ............................................... 139
8.4 No High Voltage............................................................ 140
9 Personal Protective Equipment (PPE)................................. 141
10
Lockout/Tagout ..................................................................... 142
11 Facility Requirements........................................................... 143
11.1 EVG520 ........................................................................ 144
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