Operating instructions

Recipe Programming
Copyright © 2013 EVG 47
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4.3.5.3 Wait Charge
With this recipe command the bond system is accumulating the charge
created during the time when voltage is applied.
The Wait Charge command allows that all bonded substrates got
exactly the same amount of charge.
The charge has to be inserted in mC (Milli Coulomb).
Figure 39 - Wait Charge
Value
Description
Charge
Enter the target charge.
Timeout
Activate timeout.
Deadline
Enter a timeout value. It defines the maximum allowed wait time
for the charge setpoint. It will be reached until the error recovery
action is activated.
RecoveryAction
Choose the error recovery action.
It is recommended to use the Timeout feature only in well-known and
often used processes. The command is not useable for R&D processes
as long as parameters are changed often. The risk that the system
stops the process because of a wrong Timeout is high.
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