Operating instructions

Recipe Programming

4.3.2 Vacuum System

Most wafer bonding processes require to be performed under vacuum.

The vacuum system recipe steps allow evacuating and/or purging the

bond chamber or waiting until a certain vacuum is reached in the bond

chamber.

4.3.2.1 Evacuate

With this recipe command the evacuation of the bond chamber can be

started or stopped.

Evacuate Low:

Evacuates the chamber only with roughing pump and without switching

to the Turbo Molecular Pump.

Evacuate High:

Evacuates the chamber with the roughing pump and switches to the

Turbo Molecular Pump later on.

Evacuate Off:

Stop evacuation of the chamber (close valves).

Figure 28 - Evacuate

Value

Description

Mode

Select the evacuate mode.

Setpoint

Enter a setpoint for the pressure in the chamber.

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