Operating instructions

Recipe Programming
Copyright © 2013 EVG 31
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4.3.1 Heater
Top and bottom heaters are used to reach a certain temperature in the
bond chamber necessary for wafer bonding. Therefore the heater will
heat or cool the bond chuck carrying the substrates.
Important: Heater commands are also used for cooling (by setting it to lower
temperatures)!
4.3.1.1 Set Temperature
The set temperature command is used to reach a certain temperature
by heating or cooling the top heater and / or the bottom heater.
The ramp rate defines how fast the heaters should ramp up to the target
temperature.
To define different heat up (or cooling) procedures for top and bottom
heater, the “Set Temperature” command has to be inserted two times
(one for top and one for bottom heater).
Figure 24 - Set Temperatures
Value
Description
Heater Target
Select the target heater.
Setpoint
Enter the temperature setpoint.
Gradient
Specify a heat up ramp.
Active Cooling
Select if active cooling should be activated when the specified
target temperature is lower than the current temperature.
maximum Ramp
Use maximum ramp when cooling.
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