Operating instructions

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Bond Module

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4.3 Recipe Steps

This chapter lists all recipe steps available for the bond chamber.

Note: Available recipe steps depend on system configuration.

4.3.1

4.3.4

4.3.1.1

Set Temperature

4.3.4.1

Piston Down

4.3.1.2

Wait Temperature

4.3.4.2

Piston Up

4.3.1.3

Preheat

4.3.4.3

Wait Force

4.3.1.4

Equalize

4.3.5

4.3.2

4.3.5.1

Set Voltage

4.3.2.1

Evacuate

4.3.5.2

Wait Current

4.3.2.2

Purge

4.3.5.3

Wait Charge

4.3.2.3

Evacuate-Purge

4.3.5.4

Check Resistance

4.3.2.4

Wait Pressure

4.3.2.5

Purge Clean

4.3.3

4.3.3.1

Flags

4.3.3.2

Wafer Bow On

4.3.3.3

Timer

4.3.3.4

Monitoring

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