Operating instructions

Bond Module

4.2 Recipes

The recipe defines all necessary parameters for processing substrates

(e.g. temperature, pressure, time etc.)

In addition to the Recipe Overview, a separate editor (sequence recipe

editor) is available for the bond chamber recipe on all systems equipped

with wafer bonding modules.

In the Recipe Overview, select the recipe step Bond Substrates by

clicking it. The blue color indicates that it is selected. Click Open

subrecipe to open the sequence recipe editor for Bond Substrates.

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