Operating instructions

Bond Module
22 Copyright © 2013 EVG
The Parameter frame can contain the following information (depending
on system configuration):
CoverState
state of the cover (opened, closed)
Top Temperature
temperature of top heater
Top Cooling
temperature of top cooling chuck
Top Observation
observation temperature of top heater
Bottom Temperature
temperature of bottom heater
Bottom Cooling
temperature of bottom cooling chuck
Bottom Observation
observation temperature of bottom heater
Force
force that is applied
Gas Pressure
it is the pressure reading in the chamber
Flow
shows the flow rate of the purge gas through
the mass flow controller
Vacuum
vacuum in the bond chamber
Voltage
voltage applied to the substrate
Current
current applied to the substrate
Charge
charge applied to the substrate
Flags
status of flags (if they are moved in or out)
Waferbow
waferbow setting (on or off)
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