Operating instructions

Process Description

2.4 Glass Frit Wafer Bonding

This type of bond is using as intermediate layer for bonding a low

melting point glass. The bond occurs by heating the substrates with

applied contact force (fig. 4).

Glass frit bonding has a high tolerance to surface roughness and can

incorporate high topography of the substrates. Glass frit material can be

deposited by screen printing or used as glass preformed sheets. This

process is very reliable and is used in high volume production by major

MEMS devices manufacturers for applications where low vacuum

encapsulation is required.

Figure 11 - Glass frit wafer bonding general principle

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