Operating instructions

Bond Module

2.3 Adhesive Wafer Bonding

Adhesive wafer bonding is a technique using an intermediate layer for

bonding. Polymers, spin-on glasses, resists and polyimides are some of

the materials suitable for use as intermediate layers for bonding. The

choice of the material for intermediate layer is always made considering

the substrate materials and topography.

The main advantages of using this approach are: low temperature

processing (maximum temperatures below 400°C), surface

planarization and tolerance to particles (the intermediate layer can

incorporate particles with the diameter in the layer thickness range).

Figure 10 - Adhesive wafer bonding general process flow

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