Operating instructions

Module Description
Copyright © 2013 EVG 7
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1.3 Bond Chuck
The substrates are fixed (clamped) on the bond chuck and the bond
chuck will then be processed (applying pressure, temperature and
vacuum) in the bond chamber.
The bond chuck design depends on the system configuration. The
following figure shows an example bond chuck design:
Figure 5 - Bond Chuck
The three separation flags on the
bond chuck keep the substrates
separated before processing them in
the bond chamber.
The two clamps on the bond chuck
clamp the substrates onto the bond
chuck. They can be released in order
to remove the substrates from the
bond chuck.
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