Operating instructions

Bond Module
6 Copyright © 2013 EVG
Main components of the bond chamber
Figure 4 - Overview main components
1
Wafer bow actuator
2
Piston
3
Top side cooling chuck
4
Thermo chuck
5
Bottom side cooling chuck
6
Flag pulling mechanism
7
Bottom side heater
8
Top side heater
1
3
4
5
6
7
8
2
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