Operating instructions

Bond Module

1 Module Description

1.1 Wafer Bonding

„Wafer-to-wafer“ and „chip-to-wafer“ (or “die to wafer”) are key enabling

processes for manufacturing of various devices ranging from Micro-

Electro- Mechanical Systems (MEMS) to advanced chips based on 3D

integration and advanced wafer-level packaging.

EVG®500 and Gemini® equipment series are designed to enable the

use of various wafer bonding processes based on different principles

and using a large variety of substrates and bonding layers (Figure 1).

Figure 1 - Wafer bonding processes classification with examples of substrates types

The equipment described in this document is designed as a universal

tool allowing easy use and operator-friendly operation.

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