Operating instructions

Bond Module
2 Copyright © 2013 EVG
Table of Contents
1 Module Description ................................................................... 4
1.1 Wafer Bonding .................................................................. 4
1.2 Bond Module ..................................................................... 5
1.3 Bond Chuck ...................................................................... 7
1.4 Safety................................................................................ 8
1.4.1 Start Heating – Heating not Possible ...................................... 8
1.4.2 Safety Switches in Cover Clamps (if equipped) ...................... 9
1.4.3 Facility Problems .................................................................. 10
2 Process Description ................................................................ 11
2.1 Direct Wafer Bonding ...................................................... 11
2.2 Anodic Wafer Bonding .................................................... 13
2.3 Adhesive Wafer Bonding ................................................ 14
2.4 Glass Frit Wafer Bonding ................................................ 15
2.5 Eutectic Wafer Bonding .................................................. 16
2.6 Transient Liquid Phase (TLP) Wafer Bonding ................. 18
2.7 Metal Thermo-compression Wafer bonding .................... 19
3 GUI ............................................................................................ 20
3.1 Jobs ................................................................................ 20
3.1.1 Overview Stations ................................................................ 20
3.2 Modules .......................................................................... 21
3.2.1 Bond Module ........................................................................ 21
4 Recipe Programming .............................................................. 25
4.1 Overview ......................................................................... 25
4.2 Recipes ........................................................................... 26
4.2.1 Edit Bond Substrates Recipe ................................................ 28
4.3 Recipe Steps .................................................................. 30
4.3.1 Heater .................................................................................. 31
4.3.2 Vacuum System ................................................................... 35
4.3.3 General ................................................................................ 40
4.3.4 Piston ................................................................................... 43
4.3.5 Voltage ................................................................................. 45
5 High Level Menu ...................................................................... 49
5.1 Cover .............................................................................. 51
5.1.1 Automatic Cover ................................................................... 51
5.1.2 IS Cover ............................................................................... 51
5.1.3 Manual Cover ....................................................................... 51
5.2 Heater ............................................................................. 52
5.2.1 Set Temperature .................................................................. 52
5.3 Piston .............................................................................. 53
5.3.1 Piston Down ......................................................................... 53
5.3.2 Piston Up ............................................................................. 53
5.4 Vacuum System .............................................................. 54
5.4.1 Evacuate .............................................................................. 54
5.4.2 Purge ................................................................................... 54
5.4.3 Evacuate – Purge ................................................................. 55
5.4.4 Leak Rate Check .................................................................. 56
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