EVG®520HE Users Manual Operator Manuals General Information Interlock List Start Up & GUI De-embossing Station EVG Explorer EVG CIMFramework EVG500 - Wafer Bonding Module Bond Module Maximum Piston Force Preventive Maintenance EaseUS Todo Backup 1 of 370
General Information Customer Support Documentation EVG EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
General Information Table of Contents 2 1 Note to the User......................................................................... 3 2 About this Manual ..................................................................... 4 3 Recovery from Errors ...............................................................
1 Note to the User 1 Note to the User Installation, adjustment, programming and maintenance (except periodical maintenance described in the manual) may only be done by qualified EVG service engineers. For further deliveries please check immediately after unpacking that the consignment confirms to the information given on the packing list. Read and understand the operating and safety instructions before you operate the unit and follow them in all respects.
General Information 2 About this Manual The following manual is written for documentation purposes. It describes the system and its modules, the GUI of the software (EVG Explorer and EVG Framework) and steps that have to be performed for preventive maintenance. It is written for operator and engineer level (see table below).
3 Recovery from Errors 3 Recovery from Errors Most errors that will occur require going into an engineering or maintenance level screen to execute certain functions to recover the tools and the system. Things that the operator can do in case of an error: 1) Press the Emergency Stop button only if injury of personnel or serious damages of the system impends immediately. 2) Call a trained maintenance person to perform what is needed to recover.
General Information History 6 Date Modification by 2011-11-17 First written WAA Copyright © 2012 EVG 7 of 370
3 Recovery from Errors EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG_GeneralInformation_GN_eng_01.
Interlock List Customer Support Documentation EVG520IS / EVG520HE EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
Interlock List Table of Contents 1 Interlock List .............................................................................. 3 1.1 1.2 1.3 Leak Sensor...................................................................... 4 Water Flow Sensor ........................................................... 5 Over Temperature Sensor ................................................ 6 1.4 EMO Button ...................................................................... 8 1.3.1 1.3.
Interlock List 1 1 Interlock List 1 4 1 Figure 1 - Top View 2 3 Figure 2 - Isometric View 1 Leakage Sensor 2 EMO Button 3 Water Flow Sensor 4 Over Temperature Sensors Copyright © 2013 EVG 3 11 of 370
Interlock List 1.1 Leak Sensor Below the cooling station and the bond chamber there is a tray with a liquid sensor. If liquid reaches the sensor the system shuts down. Sensor: Liquid level switch SK1-8-M12-P-nb-Ö Figure 3 - Leak Sensor Function: If liquid reaches the sensor only the water supply stops. Recovery Procedure: 1) It is necessary to fix the leak. 2) Restart the whole system. 3) Perform an automatic clean up (if available). 4) Start a new process.
Interlock List 1 1.2 Water Flow Sensor The water flow sensor checks the general water flow. Sensor: Flow meter RFO-165071 Figure 5 Function: If the water flow is to low the top and bottom heaters shut down after 120 sec. Recovery Procedure: 1) Check the water flow. 2) Start a new process.
Interlock List 1.3 Over Temperature Sensor The over temperature sensor checks the temperature of the heaters. 1.3.1 (3a) Over Temperature Sensor in the Electronic Rack Sensor: Temp.limiter TB45 TB/TW-2INP with BC Function: If the temperature is higher than 650°C the chamber will be disabled. Recovery Procedure: 1) Reset the temperature limiter TB45. 2) Enable the chamber. 3) Check the heating and start a new process. This failure occurs only when there is a problem with the hardware.
Interlock List 1 Location: b a Figure 7 –Bond cover There is another over-temperature sensor (“Temperature switch B12E 100°C”; marked with “c” in the picture below) on the bottom side of the bond cover.
Interlock List 1.4 EMO Button The Emergency OFF Button (EMO Button) shuts down the system immediately. Switch: Emergency off switch ABB CE4T-10R-02 Figure 9 - EMO Button Function: In an emergency situation press the nearest EMO Button on the system. Emergency situations are situations where injury of personnel or serious damages of the system impends immediately. Recovery Procedure: In order to operate the system again it has to be restarted: 1) Release the EMO button (turn clockwise).
Circuit Diagrams 2 2 Circuit Diagrams The following figure shows an example electronic drawing of an interlock connection: Figure 11 - Electronic Drawing (EMO Robot, Safety Door Interlock) Note: This is an example circuit diagram. Refer to “Technical Documentation” / “Electronic Drawings” to find all circuit diagrams of the system.
Interlock List History 10 Date Modification by 2007-10-02 First written with GCA HMA 2010-04-06 Formatted and updated WAA 2013-03-18 Formatted and updated HBA 2013-10-09 Formatted and updated HBA Copyright © 2013 EVG 18 of 370
Circuit Diagrams 2 EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG520IS+EVG520HE_InterlockList_OO_eng_04.
Start Up and GUI Customer Support Documentation EVG520 & EVG520IS EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
Start Up and GUI Table of Contents 1 System Description ................................................................... 3 1.1 System Layout .................................................................. 3 1.2 Safety................................................................................ 4 1.1.1 2 User Interface.........................................................................4 2 System Startup ..........................................................................
1 System Description 1 System Description 1.
Start Up and GUI 1.1.1 User Interface The keyboard and trackball on the user interface can be used to control the system PC. 1 2 3 Figure 2 - Keyboard Layout with Trackball 1.2 1 Left Trackball Button 3 Trackball 2 Right Trackball Button Safety Refer to Interlock List to find a detailed description about the location and functionality of all safety interlocks (e.g. Emergency OFF Button) on the system.
System Startup 2 2 System Startup 2 1 Figure 3 - Main Switch 1) Turn the main switch on the monitor (1) fully clockwise. If the three lamps above the switch are on the system is supplied with main voltage. 2) To the left of the main switch there is an emergency off button (2). The red button stands for OFF and the green button stands for ON. Press the green button. 3) Check if all circuit breakers are on. 4) In the center of the rack there is a key switch (Mini Environment).
Start Up and GUI 3 GUI After initializing the system, the Overview Jobs should look like below. Figure 4 - Overview Stations Refer to Framework and module manuals to find further information about the software.
3 GUI History Date Modification by 2012-02-29 First written HBA 2012-06-05 Updated GUI HBA 2013-10-10 Formatted HBA Copyright © 2012 EVG 7 26 of 370
Start Up and GUI EV Group Support: 8 Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: HBA File: EVG520IS+EVG520_StartUp_GN_eng_01.
De-embossing Station Customer Support Documentation EVG 520 EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
De-embossing Station Table of Contents 1 2 Process Flow for the De-embossing .......................................
Process Flow for the De-embossing 1 1 Process Flow for the De-embossing 1) Load substrate to Bond Chuck. 2) Insert separation flags (if equipped). 3) Load stamp to Bond Chuck. 4) Load stamp holder and clamp substrate and stamp if optically alignment is required step 1 to 3 will be done in the EVG6xx aligner. 5) Load bond chuck into bond chamber and start process. De-embossing process flow: 1) Unload bond chuck and load onto cooling station (let the bond chuck cool down).
De-embossing Station History 4 Date Modification by 2012-10-09 First written STM Copyright © 2012 EVG 31 of 370
Process Flow for the De-embossing 1 EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: STM File: EVG520_Deembossing Station_eng_01.
EVG Explorer Customer Support Documentation EVG EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
EVG Explorer Table of Contents 1 Overview .................................................................................... 3 1.1 Title Bar ............................................................................ 4 1.2 Main Area ......................................................................... 4 1.2.1 1.2.2 1.2.3 1.2.4 1.3 1.3.1 1.3.2 1.3.3 2 Application Groups ..................................................................5 Applications ...............................................
1 Overview 1 Overview After starting the system the EVG Explorer will be started: 1 2 3 Figure 1 - EVG Explorer 1 Title Bar 2 Main Area 3 Task Bar Copyright © 2010 EVG 3 35 of 370
EVG Explorer 1.1 Title Bar The title bar displays the EVG system (e.g. “EVG620”): Figure 2 - Title Bar 1.
1 Overview 1.2.1 Application Groups This section displays the list of application groups available to the user currently logged in. Figure 4 - Application Groups The currently selected application group is highlighted by a white background.
EVG Explorer 1.2.1.1 Maintenance Tools Only maintenance and service engineers have access to the maintenance tools. The Maintenance Tools: click here to open special Tools needed for Maintenance like Explorer, Services or Notepad.
1 Overview 1.2.2 Applications This section displays all applications in the currently selected application group that are available to the user that is currently logged in. To start an application, double-click on it or select it and press “Enter”.
EVG Explorer 1.2.2.1 EVG Control Software The application group “EVG Control Software” is available to every user group. The following applications can be found in the application group “EVG Control Software”: Application: Description: opens system software opens system documentation 1.2.2.2 Maintenance Tools Maintenance Tools is available to engineer level or higher. The application group “Maintenance Tools” contains special tools needed for maintenance (e.g. Explorer, Services or Notepad).
1 Overview 1.2.3 Operating System Controls Depending on user level the following controls are available: Change EVG Explorer user Log off EVG Explorer user Shut down 1.2.3.1 Login / Change User Click the “Change user” button to login or change user. In the dialog window enter the user name and password and click on “OK” to confirm. Figure 6 - Change User 1.2.3.2 Log Off Click on 1.2.3.3 to log off. Shut Down Click on the “Shut down” button .
EVG Explorer 1.2.4 Status Bar 1 2 3 4 Figure 8 - Status Bar 1 Information about the computer 2 Displays the current RAID Controller State: green icon: orange icon: red icon: 3 Normal Rebuilding/Migrating/Verifying Failed/Degraded Displays the current EVG Backup Tool State: green icon: orange icon: red icon: 4 Up to date Unknown Out of date Currently used disk space. 1.3 Task Bar 1 2 3 Figure 9 - Task Bar 1.3.
1 Overview 1.3.2 Running Applications All running applications are displayed here. Moving the mouse cursor over an icon will show the application name. Left-click on an icon to open the corresponding application or right-click on it to open the context menu (to show, minimize, close or kill the application). 1.3.3 Date and Time Displays the current date and time. The date and time are formatted according to the current date and time format settings in Windows.
EVG Explorer 2 “EVG Remote Support” Tool Open “Maintenance Tools” (1) and double-click on “EVG Remote Support” (2) to start the tool: 1 2 Figure 10 - EVG Remote Support 12 Copyright © 2010 EVG 44 of 370
2 “EVG Remote Support” Tool 2.1 EVG TechSupport offline The EVG Remote Support Tool is started, but the EVG TechSupport is offline.
EVG Explorer 2.2 EVG TechSupport online The EVG Remote Support Tool is started and the EVG TechSupport is online. Enter a text in bottom message box and click on the button „Send“.
2 “EVG Remote Support” Tool 2.3 Benefits • • • • • • • Secure 256 bit AES encrypted connection No software installation needed (at customer site) Fast response time Remote failure diagnostics / troubleshooting Simple application Session initiated by customer Customer needs to approve every data transfer 2.4 Requirements • • Access to http://www.evgroup.
EVG Explorer 3 “EVG Manual Copy” Tool 3.1 Copy Manual Open “Maintenance Tools” (1) and double-click on “EVG Manual Copy” (2) to start the tool: 1 2 Figure 14 - Starting EVG Manual Copy Insert the documentation CD into the CD drive and select the correct drive in the tool (1). Afterwards click on “Copy” (2): 1 2 Figure 15 - EVG Manual Copy Process Note: EVG Manual Copy requires engineer login level or higher.
3 “EVG Manual Copy” Tool 3.2 Open Manual Open “EVG Control Software” (1) and double-click on “EVG Manual” (2) to start the tool: 1 2 Figure 16 - Opening EVG Manual Note: EVG Manual can be opened by any user group. 3.3 Troubleshooting Error: Possible cause: Solution: “Copy Process failed: The device is not ready.” No CD in the CD drive selected. Make sure that the documentation CD is inserted in the CD drive selected in the Manual Copy tool. Wrong CD in the CD drive selected.
EVG Explorer History 18 Date Modification by 2009-04-22 First written with EDC STZ 2009-07-22 Added and updated screenshots STZ 2009-08-25 Updated screenshots STZ 2010-09-29 Reworked and added Remote Support, Manual Copy WAA Copyright © 2010 EVG 50 of 370
3 “EVG Manual Copy” Tool EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG_Explorer_eng_04_extern.
EVG CIMFramework - Core Customer Support Documentation EVG EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
EVG CIMFramework - Core Table of Contents 1 Start Up ...................................................................................... 4 1.1 1.2 1.3 1.3.1 1.3.2 1.3.3 1.3.4 1.3.5 1.3.6 2 Disconnected State ................................................................ 9 Disabled / Not-Initialized State................................................9 Ready State .........................................................................10 Maintenance Mode ..........................................
Start Up 1 4.4 Edit Recipe ...................................................................... 53 4.5 4.6 4.7 4.8 4.9 Open Recipe ................................................................... 59 Save Recipe .................................................................... 60 Export Recipe.................................................................. 61 Delete Recipe.................................................................. 62 Recipe Validation ...................................
EVG CIMFramework - Core 1 Start Up 1.1 Login 1) After starting the system the EVG Explorer is opened. Double-click EVG CIMFramework. Figure 1 - EVG Explorer 2) 4 Wait while EVG CIMFramework is loading.
Start Up 3) 1 Enter the User Name and Password in the login window and click Login to confirm. Figure 2 - EVG CIMFramework Login After a successful login the Overview Stations of the window Jobs will be displayed.
EVG CIMFramework - Core 1.2 Initialize Click System in the bottom navigation bar. The window Overview in System will be opened.
Start Up 1 In the System frame there is an area displaying the current Equipment Processing State. Click the following button to initialize the system. While the system initializes the Equipment Processing State is Initializing. As soon as the state is Idle the initializing process is finished and the software can be used to operate the system.
EVG CIMFramework - Core 1.3 Equipment Processing State The following overview lists all possible equipment processing states and how they interact. Figure 5 - Equipment Processing State Refer to the following chapters to find detailed descriptions of all module states.
Start Up 1.3.1 1 Disconnected State Module is physically disconnected (optional). Module is ignored and not controlled by the equipment. Is entered and left when instructed by the user. Figure 6 - Disconnected State Right-click a module and select Connect to switch from disconnected to connected state (or Disconnect to switch from connected to disconnected state). Figure 7 - Connect Module 1.3.
EVG CIMFramework - Core Right-click a module and select Enable to switch from disabled to enabled state (or Disable to switch from enabled to disabled state). Figure 9 - Enable Module 1.3.3 Ready State Module is ready for executing or cleanup. Ready state is entered after successful module initialization. Minimized set of high-level commands for operation. Figure 10 - Ready State Right-click a module in “Ready” state to find a limited set of high-level commands for operation.
Start Up 1.3.4 1 Maintenance Mode Module is not available for executing or cleanup. Maintenance mode is entered and left by selecting the command from the high-level menu (see below). It can be entered prior and after module initialization. It offers a maximized set of high-level commands for maintenance. Figure 12 - Maintenance Mode Click a module in Maintenance Mode to find further high-level commands (e.g. for maintenance).
EVG CIMFramework - Core 1.3.5 Executing State While in Executing state, the module is in use by the equipment to finish the current job or to perform a cleanup. It is entered automatically on demand. It is left automatically if the module is no longer required. Executing, waiting for material: 1.3.6 Cleanup State 12 Executing and processing a material: A cleanup is required if there is a material on any module without it being dedicated to any specific job.
GUI 2 2 GUI The basic layout of every window in EVG CIMFramework is divided into the following three parts: 1 2 3 Figure 14 - Basic Layout 1 Status information 2 Content of the current window (e.g.
EVG CIMFramework - Core Status Information The status information is located on the top of the screen. It is always visible while working with the EVG CIMFramework and it is used to find all important status information about the system while operating it. 1 2 3 4 5 6 7 Figure 15 - Status Information 1 2 Current system date and time. Date format: YYYY-MM-DD Time format: HH:MM:SS 3 Displays the “current view” (which window and submenu is currently opened). E.g.
GUI 2 Navigation Bar The navigation bar is located at the bottom of the screen. It is always visible while working with the EVG CIMFramework and can be used to toggle between the main windows. Figure 16 - Navigation Bar Menu item: Description: Displays overview and settings of all stations, jobs and materials. Depending on the user group certain high-level commands can be executed by using the context menu of the modules. A detailed overview of all modules in the system can be found here.
EVG CIMFramework - Core 2.1 Jobs Click Jobs in the bottom navigation bar: The Overview Stations of Jobs window will be opened. The modules displayed vary depending on system configuration. The following example displays three cassette stations and a robot module with a prealigner.
GUI 2.1.1 2 Overview Stations The Overview Stations displays an overview of all modules in the system (e.g. Robot Module). The following overview shows an example module setup. The modules displayed vary depending on system configuration. Figure 18 - Overview Stations Click a module in Overview Stations to open its context menu.
EVG CIMFramework - Core 2.1.1.1 Station Status The current station status is indicated by its border color. Refer to the following examples to find all module states.
GUI 2.1.1.2 2 Multiple Slot Modules Modules with multiple slots offer settings for single slots (sub modules) and for the entire module. The following example of a buffer station module shows the basic function principle of multiple slot modules. The detailed description for each module can be found in the corresponding module manuals.
EVG CIMFramework - Core 2.1.2 Overview Jobs The Overview Jobs tab contains a list of all queued, active and completed jobs.
GUI 2 2.2 Modules Click Modules in the bottom navigation bar: The Modules window contains a detailed overview of all modules in the system. 2.2.1 Example: Robot Handling System The following example shows the basic purpose of the module windows. The module window of Robot Handling System can be used to operate the robot (e.g. switch between “Normal Mode”, “Safe Mode” and “Train Mode” or to open the “GencoBot ToolBox”).
EVG CIMFramework - Core 2.3 Recipes Click Recipes in the bottom navigation bar: The Recipes window will be opened: Figure 24 - Recipe Window In the screenshot above the Recipes window is empty because no recipe is opened. Refer to chapter 4 Recipe Programming to find further information about how to work with recipes and refer to module-specific Recipe Programming manual (if available) to find out how to work with recipes.
GUI 2 2.4 System Click System in the bottom navigation bar: The System window will be opened: Figure 25 - System Window The System window contains different sub windows that display basic system information and settings (e.g. Low I/O, Recipe Namespace Management…). Note: Available system windows vary depending on access rights and system configuration.
EVG CIMFramework - Core 2.4.
GUI 2.4.1.1 2 System Frame The System frame is used to control the system state (close application, initialize or shutdown system). It also displays the current Equipment Processing State (see chapter 1.3 Equipment Processing State for further information). Figure 27 - System Frame 2.4.1.2 Application Health Frame The Application Health frame displays information about computer performance (e.g. used CPU in %, threads, memory in MB…).
EVG CIMFramework - Core 2.4.1.3 Information Frame The Information frame displays version information (e.g. operating system, EVG CIMFramework, modules…).
GUI 2.4.2 2 Safety Doors Open the tab Safety Doors to find the current state and controls of safety doors and system interlocks. The following example shows a system with an aligner and a bonder module. These modules can be controlled separately. Figure 30 - Safety Doors Current state of interlock override Current state of the safety doors and interlocks of one module. Lock the selected safety door(s). Request unlock of the selected safety door(s). Lock all safety doors of the system.
EVG CIMFramework - Core 2.4.2.1 Interlocked Modules The following area displays the current status of interlocked modules. The following states can be displayed in this overview. All doors are closed and locked. Module is not ready yet (disallows opening doors). Module is ready (allows opening doors). Refer to chapter 5 Safety Doors for information about how to operate the safety doors. 2.4.3 Tooling Profiles Open the tab Tooling Profiles to switch between available tooling profiles.
GUI 2.4.4 2 Facility Management Open the tab Facilities. The current state of facility items is displayed here (the displayed items vary depending on the system configuration).
EVG CIMFramework - Core 2.4.5 Tracking Open the Tracking tab to find an overview of all materials that are currently on any station in the system. Figure 32 - Tracking If the software indicates that there is a substrate on a module while there is no physical substrate on it (e.g. due to an error) the button can be used to notify the software about it. 2.4.
GUI 2 2.5 Setup Click Setup in the bottom navigation bar: The User Management will be opened. 2.5.1 Users for this machine This area can be used to set up user accounts in general (add, remove, change).
EVG CIMFramework - Core Add User Click on to open the window “Add User”: Figure 34 - Add User Enter the user information and select a user group. The following groups are available: Operator: lowest access rights Maintenance: access rights for maintenance tasks Engineer: access rights for engineer tasks Administrator: highest access rights After entering all user information, click to confirm. Remove User Select a user and click on to permanently remove it.
GUI 2.5.1.1 2 Custom Access Levels Use the following list to change the access levels for specific program functions: Figure 35 - Custom Access Levels 2.5.2 Light Tower Settings Open Light Tower Settings tab to adjust how certain system states (e.g.
EVG CIMFramework - Core 3 Jobs 3.1 Job Controls Add a new job to queue. After confirming by clicking OK, the job will be started immediately. Stop current job. Finishes process on all substrates which are currently in the system. Abort current job. Each module finishes its current process and stops afterwards. All used materials will stay in the current module. Cleanup system (see chapter 3.2 Clean Up (optional)) Unloads all substrates into a cassette and all bond chucks onto the buffer station.
Jobs 3 3.2 Clean Up (optional) If there is a substrate in any module, it is required to perform a cleanup. If the system contains modules that cannot detect wafers (e.g. plasma chamber), the software will assume that there is a substrate in the module. This will set the Equipment Processing State to Aborted. A cleanup is required to set the state to Idle.
EVG CIMFramework - Core 3.
Jobs 3) 3 The window Add Job appears. Select a namespace and recipe from the list and click Next to continue. If there is a recipe code associated with the recipe, a handheld ID reader can be used to select the recipe. Figure 38 - Add Job Window The options in the following windows vary depending on the system configuration. The material source and destination has to be defined (e.g. loadports).
EVG CIMFramework - Core 38 4) Click Add Carrier to select a carrier for source and destination slots. 5) Select or deselect the source and destination slots for each carrier and click Next to continue.
3 Jobs 3.
EVG CIMFramework - Core 4 Recipe Programming Click Recipes in the bottom navigation bar. The Recipes window will be opened.
Recipe Programming 4 4.1 Recipe Namespace Note: Every recipe has to be assigned to a “Recipe Namespace” (RNS). If none exists yet it has to be created first! 4.1.1 4.1.2 Create new Namespace 1) Click Create new namespace. 2) Enter all parameters and click OK to confirm. Modify Namespace 1) Select an existing namespace. 2) Click Modify namespace. 3) Enter all parameters and click OK to confirm.
EVG CIMFramework - Core 4.1.3 42 Delete Namespace 1) Select an existing namespace. 2) Click Delete namespace. 3) Click Yes to confirm. Note that the namespace and all its recipes are deleted.
Recipe Programming 4 4.2 Recipe Overview The Recipe Overview defines the flow of the substrate. It also describes on which stations and in which order the substrates are processed (see example below).
EVG CIMFramework - Core 4.2.1 Select Namespace Click one of the recipe Namespaces on the left to select it. Figure 41 - Namespace Selection The Recipe Selection area lists all recipes of the selected recipe namespace. Figure 42 - Recipe Selection The Common Task View displays all recipe namespace commands.
Recipe Programming 4.2.2 4 Select Single Recipe Click one of the Recipes on the left to select it. Figure 44 - Recipe Selection The Version Selection area will list all versions of the selected recipes. Figure 45 - Version Selection The Common Task View will display recipe information and recipe commands (e.g. delete recipe).
EVG CIMFramework - Core 4.2.3 Select Multiple Recipes Click multiple Recipes while holding SHIFT key to select multiple recipes at once. Figure 47 - Recipe Selection The Common Task View will display recipe information and recipe commands for multiple recipes (e.g. delete all recipes selected).
Recipe Programming 4.2.4 4 Select Version Click one of the Versions to select it. Figure 49 - Version Selection The Common Task View will display version information and version commands (e.g. save version as…).
EVG CIMFramework - Core 4.3 Create New Recipe Select the namespace that the new recipe should be created in. Figure 51 - Select namespace Click Create recipe in namespace. Figure 52 - Create recipe Choose between flowable and linkable recipe and enter a recipe name and comment (optional). Click OK to confirm.
4 Recipe Programming The Recipes window will open the recipe created. The window is divided into the following areas: 2 1 3 5 4 Figure 54 - Sample Recipe 4.3.
EVG CIMFramework - Core 4.3.3 Recipe Commands This list contains all recipe commands that can be used on the system. Example: Figure 55 - Recipe Commands Refer to module manuals to find detailed descriptions of all recipe commands. 4.3.4 Recipe Flow Diagram The recipe flow can be set up in the recipe flow diagram.
Recipe Programming 4.3.5 4 Common Task View The Common Task View changes depending on the active selection in Recipe Overview. It displays information and/or actions for the selected item(s). 4.3.5.
EVG CIMFramework - Core 4.3.5.2 Recipe Command(s) Selected If one or more recipe step is selected, certain menu items are displayed in the Common Task View. The available items depend on the recipe command(s) selected. Example: Figure 57 - Common Task View - Recipe Command(s) Selected 4.3.5.3 Recipe Flow Step Selected If a recipe flow step is selected, a description is displayed in the Common Task View.
4 Recipe Programming 4.4 Edit Recipe 4.4.1 Create Recipe Command Drag and drop a recipe command from the left onto the blank field on the right to create a recipe command: A recipe command without any connection will be created: 4.4.2 Select Recipe Command Click a recipe command to select it. The color will change to blue (see below).
EVG CIMFramework - Core 4.4.3 Recipe Command Menu After selecting a recipe command, settings will appear to the right (available options vary depending on recipe step). Refer to the following chapters for further information. 4.4.3.1 Open Subrecipe or right-click the recipe step and select Open Click Subrecipe to open settings of the recipe command (if available).
Recipe Programming 4.4.3.2 4 Select Modules for Process Click or right-click the recipe step and select Open Module Selection to open settings for the links of the recipe command. Figure 61 - Select Modules for Process Select the modules that should be used for processing the recipe command and select a handling type for each material location.
EVG CIMFramework - Core 4.4.3.3 Disconnect Recipe Command Either click Disconnect recipe command or right-click a recipe command and select Disconnect to remove all connections to the recipe command. Linked: 4.4.3.4 Unlinked: Copy Recipe Command Either click or right-click a recipe command and select Copy to copy the selected recipe command(s) to the clipboard. 4.4.3.5 Delete Recipe Command Either click or right-click a recipe command and select Delete to copy the selected recipe command(s). 4.4.3.
Recipe Programming 4.4.4 4 Context Menu Right-click a recipe command or any blank area in the recipe window to open the context menu. Open Subrecipe Open the subrecipe editor of the recipe step (see chapter 4.4.3.1 Open Subrecipe). Open Module Selection Select which modules should be used for processing (see chapter 4.4.3.2 Select Modules for Process). Unlink Remove all links of the recipe command (see chapter 4.4.6.1 Unlink Recipe Steps). Delete Delete the selected recipe step(s) (see chapter 4.
EVG CIMFramework - Core 4.4.5 Delete Recipe Command Select a recipe step or multiple recipe steps (using CTRL or SHIFT key), press Delete key on keyboard or right-click and select Delete from the context menu. 4.4.6 Link Recipe Commands Drag and drop from a connecting point of one recipe command to the connecting point of another recipe command to create a link. 4.4.6.
Recipe Programming 4 4.5 Open Recipe Browsing and opening recipes can be done in the recipe overview window. If not currently open, it can be accessed by clicking Recipe Management in the navigation bar. Select a Namespace from the list or use one of the functions above to display recently opened, modified or processes recipes. Select a Recipe by selecting it from the list of available recipes.
EVG CIMFramework - Core 4.6 Save Recipe The button can be used to save changes made to a recipe. A new version will be added to the current recipe file and all previous versions can still be accessed afterwards if needed. To save the current recipe as a new recipe file, click . In the following window select a Recipe Namespace and enter a Recipe Name and Comment (optional). Click OK to confirm. Figure 62 - Save Recipe as...
Recipe Programming 4 4.7 Export Recipe 1) Select the recipe that has to be exported. 2) Click Export to human readable file… 3) Open the exported file (a web browser that supports SVG files is required). The exported file includes meta information (e.g. recipe name, version), substrate flows and parameters/settings of the module recipes.
EVG CIMFramework - Core 4.8 Delete Recipe In the recipe overview window, select the Namespace that contains the recipe that should be deleted. Select the Recipe that should be deleted. Click Delete recipe or select a version and click Delete version to delete the recipe or only the selected version of the recipe. The following dialog box will appear prompting to confirm deleting the recipe or specific version of the recipe.
Recipe Programming 4 4.9 Recipe Validation 4.9.1 Static Recipe Validation A recipe can be validated for issues on opening and saving. It has to be validated when adding a job (a job cannot be started if there is an issue with the recipe). The last known validation result is shown in the details section of the common task view. The recipe can also be validated by clicking the Validate button in the recipe controls at any time.
EVG CIMFramework - Core 4.10 Recipe Linking Linkable recipes define a process on a module. In the following example an existing module recipe for the bond module is linked as a reference. Changes made to the “Bond Substrates” recipe affect all recipes where it is linked. The blue icon indicates if the recipe step is embedded or linked. 4.10.1 Link Embedded Recipe When creating a linkable recipe command, the following options are available.
Recipe Programming 4.11 4 Recipe Code A recipe code identifies a recipe with a specific ID. The recipe code is associated with the recipe. 4.11.1 Edit Recipe Code 1) Open the recipe that should be edited. 2) Click on a blank space of the recipe editor to display the common task view of the entire recipe (recipe parameters and commands). Click Set recipe code… 3) Enter a recipe code and click OK to confirm.
EVG CIMFramework - Core 5 Safety Doors 5.1 Activate Interlock Override The interlock override key is located next to the main switch. After activating interlock override, it will be highlighted in the software.
Safety Doors 5 5.2 Open Safety Doors After initializing the system, a Request Unlock can be sent to unlock the safety doors for maintenance work. The interlocked modules (e.g. robot) will be paused. Go to System and open Safety Doors. Note: By default, maintenance user level is required to be able to open the safety door window. The following window will be displayed where the current state is displayed and safety doors can be locked and unlocked.
EVG CIMFramework - Core By default, the state of all safety doors is Closed and Locked. Click Request Unlock or Request Unlock all Safety Doors. After unlocking the safety door, the state will change to Closed. After opening the safety door, the state will change to Open. The Lock button is deactivated until the doors are closed again.
Safety Doors 5 5.3 Close Safety Doors In the following example all safety doors are opened. Figure 67 - Safety Doors Opened After closing the safety doors, the state changes to Closed and the Lock button is activated again. Click Lock or Lock all Safety Doors to lock the safety doors. The state changes to Closed and Locked. As soon as all safety doors are closed and locked again, all modules will continue processing.
EVG CIMFramework - Core 6 Analysis Click on the button Analysis in the bottom navigation bar: The Analysis window will be opened which is divided in the following three tabs: Log Information DataValue State Performance Tracking 6.1 Log Information Figure 68 - Analysis The following information will be displayed in the Analysis window: 70 Column: Description: Examples: Timestamp Time format: [hour]:[minute]:[second].[millisecond] 10:42:19.
Analysis 6 Logfile Details Double-click on a logfile message to open Logfile Details: Figure 69 - Logfile Details 6.2 DataValue State The DataValue window visualizes all available data values and their current value. It includes status variables, data variables and equipment constants. The 1000 previous values are stored and displayed.
EVG CIMFramework - Core 6.3 Performance Tracking This window allows analyzing performance statistics for the entire system and each module (e.g. idle time). The data collected can be used for: Statistics Error analysis Analysis of module process and handling times Uptime calculations Throughput calculations The performance is tracked by monitoring the time spent in each state (e.g. Idle, Busy and Blocked).
Analysis 6 If more than one module is selected for performance tracking, a graph for each module will be displayed in a row. The values of all selected modules can be compared (see below). Figure 72 - Comparing Performance The current module performance state is also indicated by an icon on the header of each module (see example below).
EVG CIMFramework - Core 6.4 Reports The Reports window allows collecting and listing certain events and its corresponding parameters (e.g. process started or finished). Figure 73 - Reports Click the following button to create a new report for an event. Adjust the report filter settings and click OK to confirm.
Alarms 7 7 Alarms 7.1 Overview The Alarms window can be opened by clicking on Alarms (1) in the bottom navigation bar or by clicking on the status information icon (2) displaying the status (e.g. “OK”): The Alarms window will be opened: Figure 75 - Alarms Timestamp Time format: [hour]:[minute]:[second].[millisecond] Type Type of the event (e.g. “Information”). Source e.g. Module Message Alarm message Operator Operator (e.g. Administrator) Recoverable, dialog with options.
EVG CIMFramework - Core 7.2 Alarm Situation If there is an error, the button in bottom navigation bar and the icons on the top right corner of the screen will change to the following: Button in bottom navigation bar: Icons on top right corner of the screen: The number in the alarm icon indicates the number of active alarms or errors. Click the button Alarms or the red alarm icon on the top right corner of the screen to open Alarms window.
I/O 8 8 I/O Depending on the module, the I/O displays a list of I/O information and controls (e.g. digital input, digital output, analog input, axis and gauge). 1) Go to System > I/O to open the I/O window. 2) Select one or more modules from the list on the right to display its I/O information and controls. Notice: If not handled with care, changing settings in I/O can cause severe damage to the system. There are no software security blocks that guard the system.
EVG CIMFramework - Core 9 Shut Down Note: All safety doors have to be closed and locked before shutting down the system (refer to chapter 5 Safety Doors)! 78 1) After finishing all running processes click Shutdown in the System window: 2) Wait until the Equipment Processing State is NotInitialized: 3) Click Close Application: 4) In the following window click Yes to close EVG CIMFramework: Copyright © 2013 EVG 129 of 370
Shut Down 5) In EVG Explorer click the shut down button 9 (see below): Figure 77 - Shut down button in EVG Explorer 6) In the shut down window select Shut down (default) and click OK to shut down the operating system: Figure 78 - “Shut down”-window 7) Wait until the screen “It is now safe to turn off your computer” shows up and then turn off the system.
EVG CIMFramework - Core History 80 Date Modification by 2010-10-20 First written with SPU, OC, ACS WAA 2011-05-18 Updated to core manual with SSN WAA 2011-11-17 Updated to version 2.0 WAA 2012-05-10 Updated to version 2.1 WAA 2012-12-06 Updated to version 2.2 WAA 2013-05-07 Updated to version 2.
Shut Down 9 EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG_Framework_EO_eng_2.3.doc Created on: 2012-12-06 Printed on: 2013-05-07 Version: 2.
Bond Module Customer Support Documentation EVG CIMFramework EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
Bond Module Table of Contents 1 Module Description ................................................................... 4 1.1 1.2 1.3 1.4 1.4.1 1.4.2 1.4.3 Start Heating – Heating not Possible ......................................8 Safety Switches in Cover Clamps (if equipped) ......................9 Facility Problems ..................................................................10 2 Process Description ................................................................ 11 2.1 Direct Wafer Bonding ..
Module Description 5.5 High Voltage.................................................................... 56 5.6 Flags ............................................................................... 57 5.7 Recorder ......................................................................... 57 5.8 Wafer Bow....................................................................... 58 5.9 Resistance ...................................................................... 59 5.5.1 5.6.1 5.7.1 5.8.1 5.8.2 5.
Bond Module 1 Module Description 1.1 Wafer Bonding „Wafer-to-wafer“ and „chip-to-wafer“ (or “die to wafer”) are key enabling processes for manufacturing of various devices ranging from MicroElectro- Mechanical Systems (MEMS) to advanced chips based on 3D integration and advanced wafer-level packaging. EVG®500 and Gemini® equipment series are designed to enable the use of various wafer bonding processes based on different principles and using a large variety of substrates and bonding layers (Figure 1).
Module Description 1 1.2 Bond Module The bond module is used to perform wafer bonding processes (as described in the previous chapter). Figure 2 - Bond Module The number of bond modules in the system can vary depending on the system configuration.
Bond Module Main components of the bond chamber 1 2 3 8 4 7 5 6 Figure 4 - Overview main components 6 1 Wafer bow actuator 2 Piston 3 Top side cooling chuck 4 Thermo chuck 5 Bottom side cooling chuck 6 Flag pulling mechanism 7 Bottom side heater 8 Top side heater Copyright © 2013 EVG 138 of 370
Module Description 1 1.3 Bond Chuck The substrates are fixed (clamped) on the bond chuck and the bond chuck will then be processed (applying pressure, temperature and vacuum) in the bond chamber. The bond chuck design depends on the system configuration. The following figure shows an example bond chuck design: Figure 5 - Bond Chuck The three separation flags on the bond chuck keep the substrates separated before processing them in the bond chamber.
Bond Module 1.4 Safety Refer to Interlock List to find a detailed description about the location and functionality of all safety interlocks (e.g. Emergency OFF Button) on the system. 1.4.1 Start Heating – Heating not Possible When the temperature of the heating cartridge ground plate gets over 80°C, the over temperature switch releases the heaters switch (controlled by EVG Bond Software) and the heaters are shut off immediately.
Module Description 1.4.2 1 Safety Switches in Cover Clamps (if equipped) Figure 7 - Cover Clamp If the four cover clamps on each bond module are not closed properly when trying to start a process, an error message will occur (“Cover not locked. Not possible to start process!”). Open the cover again and check the stack height (16mm). Close the cover and try to restart the process.
Bond Module 1.4.3 1.4.3.1 Facility Problems Missing Water Flow If the water flow is missing a timer will be started (standard: 2 minutes) and a message box will appear on the screen. Click on “OK” to confirm the message box. In the meantime the chamber will continue processing but the handling will be paused. Water flow resumes in time: Water flow does not resume in time: If the water flow resumes within the time set, the message box has to be confirmed by the user.
Process Description 2 2 Process Description The following chapters describe processes that can be performed on EV Group wafer bonding equipment. 2.1 Direct Wafer Bonding This is a wafer bonding method in which the adhesion between two surfaces occurs as a result of chemical bonds established between molecules from the two surfaces.
Bond Module Surface activated wafer bonding is also a direct bonding method which uses a special surface preparation process (surface activation) in order to change and control the bonding mechanism by controlling the surface chemistry. After surface activation, higher energy bonds are formed at room temperature (even covalent) compared to the nonactivated surfaces and thus the energy required to reach the maximum bond strength by forming covalent bonds across the entire bonded interface is lower.
Process Description 2 2.2 Anodic Wafer Bonding Initially reported for joining a metal surface to a glass surface, the term “anodic bonding” is used today mainly to identify the bonding of silicon wafers to glass wafers with high content of alkali oxides (fig. 2). The glass materials mostly used for anodic bonding are Borofloat from Schott Glass - Germany, and Pyrex7740 from Corning Inc., USA. The bond occurs when the two wafers are heated after being brought in contact and an electric field is applied.
Bond Module 2.3 Adhesive Wafer Bonding Adhesive wafer bonding is a technique using an intermediate layer for bonding. Polymers, spin-on glasses, resists and polyimides are some of the materials suitable for use as intermediate layers for bonding. The choice of the material for intermediate layer is always made considering the substrate materials and topography.
Process Description 2 2.4 Glass Frit Wafer Bonding This type of bond is using as intermediate layer for bonding a low melting point glass. The bond occurs by heating the substrates with applied contact force (fig. 4). Glass frit bonding has a high tolerance to surface roughness and can incorporate high topography of the substrates. Glass frit material can be deposited by screen printing or used as glass preformed sheets.
Bond Module 2.5 Eutectic Wafer Bonding This is a wafer bonding process which uses as bonding layer an eutectic alloy formed during bond process. Eutectic alloy is formed at the bonding interface in a process which goes through a liquid phase: for this reason, eutectic bonding is less sensitive to surface flatness irregularities, scratches, as well as to particles compared to the direct wafer bonding methods (metal layer can incorporate particles with diameter lower than the eutectic layer thickness).
Process Description 2 Experimental results showed that good quality interfaces are obtained when temperature is raised to a value lower than the eutectic temperature (heating simultaneously from top/bottom), maintained constant for short time to reach uniform heating of both wafers, than increased again by heating both heaters to a temperature exceeding the eutectic point with 10-20°C (depending on specific process conditions and on substrates restrictions) followed by cooling down to a temperature below
Bond Module 2.6 Transient Liquid Phase (TLP) Wafer Bonding For some applications the process temperatures must be lower than the bonding temperatures of the most usual eutectic alloys (300°C - 400°C). In such situations an alternative process can be used, which results in an inter-metallic compound bonding layer. In literature this process is known under different names among which can be mentioned “diffusion soldering” or Transient Liquid Phase (TLP) bonding.
Process Description 2 2.7 Metal Thermo-compression Wafer bonding Quite often people are wrongly considering that thermo-compression and eutectic bonding are one single process. In thermo-compression bonding process the two surfaces adhere to each other due to a metal bond established between two metal surfaces pressed together under heating.
Bond Module 3 GUI 3.1 Jobs Click Jobs in the bottom navigation bar: 3.1.1 Overview Stations The overview of all stations contains one or more bond module icons depending on the system configuration.
GUI 3 3.2 Modules 3.2.1 Bond Module Go to Modules and open the BondModule tab. It contains information about the current status of the bond module and vacuum system. 3.2.1.1 Parameter This frame displays information about the current status of the bond module (e.g. temperature or force).
Bond Module The Parameter frame can contain the following information (depending on system configuration): 22 CoverState state of the cover (opened, closed) Top Temperature temperature of top heater Top Cooling temperature of top cooling chuck Top Observation observation temperature of top heater Bottom Temperature temperature of bottom heater Bottom Cooling temperature of bottom cooling chuck Bottom Observation observation temperature of bottom heater Force force that is applied Gas Pres
GUI 3.2.1.2 3 Process Information This frame displays information about the current process. This frame is only active when a process is running. Figure 16 - Process Information 3.2.1.3 Vacuumsystem Refer to “Technical Documentation” => “Vacuum Equipment” for detailed information about the vacuum system.
Bond Module It depends on the system configuration which symbols you have in the vacuum system overview: Symbol Designation Valve/Flow control valve Different Types: Bypass valve Turbo valve Chamber valve Vent valve Purge valve Base Purge Line Manual Purge Line Roughingpump Turbopump MFC – Mass Flow Control Gases Vacuum Controller 24 Copyright © 2013 EVG 156 of 370
Recipe Programming 4 4 Recipe Programming 4.1 Overview Click Recipes in the bottom navigation bar: The Recipes window will be opened: Figure 18 - Recipe Window Note: This document contains all information relevant to bond module recipes. Refer to chapter Recipe Programming in the advanced Framework manual to find general information needed for working with recipes.
Bond Module 4.2 Recipes The recipe defines all necessary parameters for processing substrates (e.g. temperature, pressure, time etc.) In addition to the Recipe Overview, a separate editor (sequence recipe editor) is available for the bond chamber recipe on all systems equipped with wafer bonding modules. In the Recipe Overview, select the recipe step Bond Substrates by clicking it. The blue color indicates that it is selected. Click Open subrecipe to open the sequence recipe editor for Bond Substrates.
Recipe Programming 4 Sequence Recipe Editor The sequence recipe Bond Substrates describes all parameters necessary for processing a substrate in the bond chamber.
Bond Module 4.2.1 Edit Bond Substrates Recipe 1) To create a new recipe step, drag and drop it to a blank line: 2) A new window will be opened where all parameters of the recipe step can be set: Figure 20 - Recipe Step Parameters 3) Click OK after entering all settings. The recipe step will be inserted in the recipe (double-click the step to open the settings window if necessary): Note: Refer to chapter 4.3 Recipe Steps for a detailed description of all recipe parameters.
Recipe Programming 4.2.1.1 4 Move Recipe Step 1) Drag and drop a recipe step to the desired position. In the following example recipe step 1 is moved between recipe step 2 and 3: A B C Figure 21 – Drag and Drop 2) After moving the order of the recipe steps would be: B A C Figure 22 - Drag and Drop 4.2.1.2 Recipe Step Context Menu Right-click a recipe step to open its context menu to find additional commands (e.g.
Bond Module 4.3 Recipe Steps This chapter lists all recipe steps available for the bond chamber. Note: Available recipe steps depend on system configuration. 4.3.1 4.3.4 4.3.1.1 Set Temperature 4.3.4.1 Piston Down 4.3.1.2 Wait Temperature 4.3.4.2 Piston Up 4.3.1.3 Preheat 4.3.4.3 Wait Force 4.3.1.4 Equalize 4.3.5 4.3.2 4.3.5.1 Set Voltage 4.3.2.1 Evacuate 4.3.5.2 Wait Current 4.3.2.2 Purge 4.3.5.3 Wait Charge 4.3.2.3 Evacuate-Purge 4.3.5.4 Check Resistance 4.3.2.
Recipe Programming 4.3.1 4 Heater Top and bottom heaters are used to reach a certain temperature in the bond chamber necessary for wafer bonding. Therefore the heater will heat or cool the bond chuck carrying the substrates. Important: Heater commands are also used for cooling (by setting it to lower temperatures)! 4.3.1.1 Set Temperature The set temperature command is used to reach a certain temperature by heating or cooling the top heater and / or the bottom heater.
Bond Module 4.3.1.2 Wait Temperature With the wait temperature command, the system waits until the specified temperature is reached (on top and/or bottom heater). According to the process command before, the system will heat or cool. Therefore the temperature will pass the defined temperature upwards (higher than) or downwards (lower than). The Timeout defines the maximum allowed wait time until the system stops the process and a timeout error message is displayed.
Recipe Programming 4.3.1.3 4 Preheat The preheat command is used to set the pre conditioned temperature and tolerance range. The temperature of a heater which is exceeding the preheating temperature can be reduced if the cooling function is activated. Note: “Preheat” command has to be used as first recipe step. Figure 26 - Preheat Value Description Preheat Temperature Top Enter the top heater target temperature. Tolerance Top Enter the top heater temperature tolerance.
Bond Module 4.3.1.4 Equalize With this recipe command the temperature of top and bottom heater can be equalized within a certain tolerance before heating. Figure 27 – Equalize Temperature 34 Value Description Mode Enter the equalize mode. Tolerance Enter the equalize tolerance. Allow Active Cooling Select if active cooling should be activated during equalize temperatures. Timeout Activate timeout. Deadline Enter a timeout value.
Recipe Programming 4.3.2 4 Vacuum System Most wafer bonding processes require to be performed under vacuum. The vacuum system recipe steps allow evacuating and/or purging the bond chamber or waiting until a certain vacuum is reached in the bond chamber. 4.3.2.1 Evacuate With this recipe command the evacuation of the bond chamber can be started or stopped. Evacuate Low: Evacuates the chamber only with roughing pump and without switching to the Turbo Molecular Pump.
Bond Module 4.3.2.2 Purge With the purge command the chamber will be filled with different types of gases after evacuation. Purge Off: Closes all purge valves and traps the current atmosphere in the chamber. Vent: Fills the chamber with air (from clean room environment). This function will be activated automatically before the chamber lid opens. It ensures that the pressure inside and outside the bond chamber is equal. Base Purge Line: Flow can be controlled manually (manual valve).
Recipe Programming 4.3.2.3 4 Evacuate-Purge With this recipe command pressure or flow can be controlled in the chamber. It has to be defined in the recipe which parameter is fixed and which one can float. There are two possibilities: It’s either possible to keep the gas inlet flow constant (MFC) otherwise it has to be adjusted with the manual needle valve. Or keep the gas pressure in the chamber constant by changing the flow.
Bond Module 4.3.2.4 Wait Pressure With the wait pressure command, the system waits until the specified vacuum in the chamber is reached. Depending on the process command before, the system will check evacuation (lower than) or purging (higher than). Figure 31 - Wait Pressure Value Description Mode Enter a wait mode. Pressure Enter a pressure target. Timeout Activate timeout Deadline Enter a timeout value. It defines the maximum allowed wait time for the pressure setpoint.
Recipe Programming 4.3.2.5 4 Purge Clean Using this recipe step will activate the purge clean function. No parameters necessary.
Bond Module 4.3.3 General 4.3.3.1 Flags With this recipe command the wafer separation flags between the top and bottom wafer can be pulled out (either all or certain ones). For pulling the flags individually, the proper check box has to be activated and the command has to be inserted three times in the recipe (each time with a different check box activated). Figure 32 - Flags 4.3.3.2 Value Description Flag 1 Select left flag. Flag 2 Select middle flag. Flag 3 Select right flag.
Recipe Programming 4.3.3.3 4 Timer With the timer command the system keeps the adjusted conditions (e.g. temperature) until the defined time is elapsed. The timer has to be specified in hours, minutes, seconds and milliseconds. Figure 33 - Timer Value Description Hours Enter the delay in hours. Minutes Enter the delay in minutes. Seconds Enter the delay in seconds. Milliseconds Enter the delay in milliseconds.
Bond Module 4.3.3.4 Monitoring With this recipe command the module parameters can be observed. It also can be checked if all values were inside specified limits. Figure 34 - Monitoring Parameters 42 Value Description Parameters Select monitoring parameters. Recovery Choose the recovery action. Mode Select monitoring mode.
Recipe Programming 4.3.4 4 Piston The piston applies the pressure necessary for the process. The piston recipe steps allow the following: 4.3.4.1 Piston Down: apply specified force to the substrate Piston Up: release force and move piston up Wait Force: apply force until a certain force is reached Piston Down With this recipe command the piston moves down and applies the specified force to the substrate. The top side heater will be in contact with the substrate. Figure 35 - Piston Down 4.3.4.
Bond Module 4.3.4.3 Wait Force With the wait force command, the system waits until the specified force is reached. Figure 36 - Wait Force 44 Value Description Mode Enter the wait mode Force Enter the target force. Timeout Activate timeout. Deadline Enter a timeout value. It defines the maximum allowed wait time for the piston force. It will be reached until the error recovery action is activated. RecoveryAction Choose the error recovery action.
Recipe Programming 4.3.5 4 Voltage The following recipe steps are available if the system is equipped with a voltage system (needed for anodic bonding processes). The voltage recipe commands allow: 4.3.5.1 Set Voltage: Enables or disables anodic bonding. Wait Current: Applies voltage until set current is reached. Wait Charge: Makes sure that all the bonded substrates got exactly the same amount of charge. Set Voltage With the set voltage command anodic bonding can be enabled or disabled.
Bond Module 4.3.5.2 Wait Current With the wait current command the system will check if the current passes the limit downwards (lower than) or upwards (higher than), according to the defined value in the field “Target Current”. Figure 38 - Wait Current Value Description Mode Enter the wait mode. Current Enter the target current. Timeout Activate timeout. Deadline Enter a timeout value. It defines the maximum allowed wait time for the current setpoint.
Recipe Programming 4.3.5.3 4 Wait Charge With this recipe command the bond system is accumulating the charge created during the time when voltage is applied. The Wait Charge command allows that all bonded substrates got exactly the same amount of charge. The charge has to be inserted in mC (Milli Coulomb). Figure 39 - Wait Charge Value Description Charge Enter the target charge. Timeout Activate timeout. Deadline Enter a timeout value.
Bond Module 4.3.5.4 Check Resistance With the check resistance command the substrate-stack resistance can be checked. If it is necessary the burn function can be activated. Figure 40 48 Value Description Resistance Enter the resistance limit. Voltage Enter voltage limit for burn function. Mode Select polarity for burn function. Time Enter burn duration. Retries Enter number of burn retries. Failure Action Define what should happen after an error.
High Level Menu 5 5 High Level Menu Click the bond module icon to open the context menu (high level): Details Go to module details window (Modules – Bond Chamber) Add Comment Add or modify the text comment of the module. Disable Disable the module. Enter Maintenance Enter maintenance mode to find further high level commands (see below). It is required to enter maintenance mode of a module to be able to execute certain module commands. Click the module and select Enter Maintenance.
Bond Module The module mode is indicated by its border color. Click the module to find maintenance mode high level commands.
High Level Menu 5 5.1 Cover 5.1.1 5.1.2 Automatic Cover Open Cover Open the bond module cover. Close Cover Close the bond module cover. IS Cover Release Brake Manually 5.1.3 Disable the cover service brake. Manual Cover There is no high level function available.
Bond Module 5.2 Heater 5.2.1 Set Temperature Set the temperature of a selected heater to apply heating. 5.2.1.1 1) Choose “Top”, “Bottom” or “Both” heaters. 2) Enter the setpoint in °C. 3) Click on to confirm. Cooling Set the temperature of a selected heater to apply cooling. 52 1) Select if cooling should be done on “Top”, “Bottom” or “Both”. 2) Select if the cooling should be switched “ON” or “OFF”. 3) Click on to confirm.
High Level Menu 5 5.3 Piston 5.3.1 Piston Down Move the piston down. 5.3.2 1) Enter the setpoint for the piston down force in N (see restrictions displayed in the tooltip). 2) Click on to confirm. Piston Up Move the piston up (no settings are required).
Bond Module 5.4 Vacuum System 5.4.1 Evacuate Evacuate the bond chamber. 5.4.2 1) Select the mode (“Evacuate off”/“Evacuate low”/”Evacuate high”). 2) Click on to confirm. Purge Purge the bond chamber. 54 1) Select the mode (“Purge Off”/“Vent”/”Base Purge Line”/”Manual Purge Line”/”MFC”). 2) Click on to confirm.
High Level Menu 5.4.3 5 Evacuate – Purge Evacuate – Purge the bond chamber. Figure 41 Figure 42 1) Select the purge mode (“Base Purge Line”/“Manual Purge Line”/”MFC”/”Vacuum Controller”). 2) Select the gas type (Nitrogen/Xenon). 3) Enter a setpoint for the purge function in mbar (if available, Figure 39). 4) Select the evacuate mode (Evacuate Low) 5) Click on to confirm.
Bond Module 5.4.4 Leak Rate Check Check the leak rate of the bond chamber. 1) Enter a target pressure for the leak rate check. 2) Enter a timeout value. 3) Click on to confirm. 5.5 High Voltage 5.5.1 56 Set Voltage 1) Select the polarity (“switch off HV”/”positive polarity”). 2) Click on to confirm.
High Level Menu 5 5.6 Flags 5.6.1 Flags Out Move the flags out (or in). 1) Select the flags that should be moved. 2) Select if the flags should be moved “OUT” or “IN”. 3) Click on to confirm. 5.7 Recorder 5.7.1 Start Recording Start (or stop) recording (recorder software).
Bond Module 5.8 Wafer Bow 5.8.1 Waferbow On Activate wafer bow function. 5.8.2 Adjust Waferbow Adjust the wafer bow screw according to the substrate stack height (Figure 43). Figure 43 58 1) Adjust the wafer bow screw. 2) Click on to confirm when done.
High Level Menu 5 5.9 Resistance 5.9.1 Get Resistance Display the measured resistance.
Bond Module 6 Recorder Software 6.1 General This software allows to record and save all process parameters. After opening the Recorder-Program following window appears: Press “Yes” to show the view as last used. Press “No” to adjust the settings new.
Recorder Software 6 6.2 Choose Parameters Choose the parameters which should be shown in the left scale. For each chosen parameter a separate scale is shown (in the same colour as the parameter line). 6.2.1 Settings for Graphs and Scales Press the right mouse button on the colour field to adjust the colour for the graphs and the scale of the chosen value. Choose a colour and press “OK” to confirm the new colour or press “Cancel” to cancel the colour adjustment.
Bond Module Press the left mouse button on the colour field for more “Graph Settigs” of the chosen value. Following window will be shown: Find general information of the chosen graph in the field “Graph Description”. Field “Y-Scale”: “Auto Range”: the software searches automatically the best view by using the available values for the chosen graph. Use “User defined Values” and enter values for “Max. Value” and “Min Value” in the defined fields. Choose “Invert Curve” to invert the chosen graph.
Recorder Software 6 Use “Settings” – “Basic Settings” or press “Ctrl” + “S” on the keyboard to adjust the basic settings for graphs, scales, measuring lines and graph update. Measuring Lines: Adjust the colors and the width of the lines (find more in item “Measure Bars”) as they should be shown. Catch Range: the mouse pointer catches the measuring line x Pixel early as the line is shown. Enter a value (for x) in the field “Catch Range”.
Bond Module 6.3 Measure Bars With the measure bar it is possible to find exact values of the visible graphs. 6.3.1 Show Measure Bar Press „Strg“ + left mouse button or „Shift“ + left mouse button to show a measure bar. (Place the mouse pointer before pressing the left mouse button where the measure bar should appear.) Up to four measure bars can be shown. Find the specific values for all measure lines in the window “Values Measure”.
Recorder Software 6.3.2 6 Move Measure Bar Move the mouse over a measure bar. The mouse button will change into double arrow (as shown). Use the left mouse button to move the measure bar. 6.3.3 Delete Measure Bar Delete one measure bar: Press “Strg” or “Shift” on the keyboard and point with the mouse on the measure bar which should be deleted and press the right mouse button. Delete all measure bars: Use the button “Delete Measure Bars” in the toolbar.
Bond Module 6.4 Zoom Draw a rectangle over the part which should be zoomed with the mouse pointer: There are four zoom- steps available. Press the right mouse button to go back one zoom- step.
Recorder Software 6 6.5 More functions of the recorder Software 6.5.1 Grids Choose the view of the grids. Choose “Linear Grid” Grid” according to the shown graphs. 6.5.2 or “Logarithmic File Info Press “File” / “File Info” or use button to open the window “File Info”. Find all corresponding information of the current file in this window. Add an additional comment if necessary. This comment will only be saved if save button will be pressed afterwards.
Bond Module 6.5.3 “Printing” Find the buttons “Print”, “Print Preview” and “Print Setup” at menu “Printing” in the menu bar. “Print Setup”: activate / deactivate printing the legend, the filename and the scales. Choose print orientation “Portrait” or “Landscape”. “Print Preview”: Take a look at the print preview before printing the document. “Print”: Print document. 6.5.
6 Recorder Software History Date Modification by 2011-11-18 First written WAA 2013-08-14 Updated screenshots, recipe steps and high level menu HBA Copyright © 2013 EVG 69 201 of 370
Bond Module EV Group Support: 70 Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG_Framework-BondModule_EO_eng_2.3_rev_02.
Maximum Piston Force Customer Support Documentation EVG5xx EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
Maximum Piston Force Table of Contents 1 2 Maximum Piston Force .............................................................
1 Maximum Piston Force 1 Maximum Piston Force The following table provides benchmark numbers for orientation what is possible with different pressure disc materials. Warning: Bondchucks and pressure discs have to match each other. EV Group recommends using appropriated pressure discs and bondchucks. Bonding of substrates which do not fit to the specified size of pressure disc and bondchuck results in lower max piston force, bending or breaking the pressure disc or substrate.
Maximum Piston Force History 4 Date Modification by 2010-03-18 First written WAA 2011-10-05 Updated values with HP WAA Copyright © 2010 EVG 206 of 370
Maximum Piston Force 1 EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG5xx_MaxPistonForce_DO_eng_02_150mm.
Preventive Maintenance Manual Customer Support Documentation EVG520 EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
Preventive Maintenance Manual Table of Contents 1 Note to the User......................................................................... 5 2 Safety ......................................................................................... 6 3 Daily Maintenance ..................................................................... 7 3.1 Control Cabinet................................................................. 7 3.2 Main Pressure...................................................................
Note to the User 5 1 Monthly Maintenance ..............................................................89 5.1 Before starting Monthly Maintenance..............................89 5.2 Cover connection lines ....................................................89 5.3 Tool Detection .................................................................90 5.4 Piston Motion ..................................................................91 5.5 Load Cell Test ........................................................
Preventive Maintenance Manual 6.4 TC Wafer Test .............................................................. 131 7 Annual Inspection ................................................................. 132 7.1 Cooling Fluid................................................................. 132 7.2 Cooling Lines ................................................................ 133 7.3 Cleaning Procedure ...................................................... 135 7.4 Vacuum Pump ...............................
Note to the User 1 1 Note to the User ! ! CAUTION HAZARDOUS AREA To be opened by trained and authorized personnel only 10023467 Installation, adjustment, programming and maintenance (except periodical maintenance described in the manual) may only be done by qualified EVG service engineers. For further deliveries please check immediately after unpacking that the consignment confirms to the information given on the packing list.
Preventive Maintenance Manual 2 Safety • The equipment represents state-of-the-art technology and optimum operationally reliable. The user may however be exposed to hazards if it is used improperly or for other than its intended purpose! • If the equipment is used for any other than its intended purpose, all liability and warranty claims will lapse! • All unauthorized modifications and alterations affecting the safety are prohibited! • The use of self-made tools is not allowed in any case.
Daily Maintenance 3 3 Daily Maintenance 3.
Preventive Maintenance Manual 3.2 Main Pressure The Main Pressure is permanently checked by the software. There must be an error message if the pressure drops below 5 bar. Inspect the main pressure regulator (1) on the rear wall. The normal static operating pressure should be around 6-8 bar. 1 Figure 1 - Main Pressure Regulator Weekly check the main pressure regulator and the filter for the presence of oil or water (see chapter “Weekly Maintenance”).
Daily Maintenance 3.3 3 Process Gases (Purge Gas) The purge gas is not permanently checked by the software! Check the purge gas pressure regulator(s) (1) and make sure that the adjusted value is correct. Location of the purge gas pressure regulator: Open the door to get access to the purge gas pressure regulator.
Preventive Maintenance Manual 1 Figure 3 - Purge Gas Regulator Range: 0-2 bar (8 inch system) Range: 0-1,3 bar (12 inch system) Make sure that purge gas pressure is sufficient, if adjustment is not possible and / or purging sequence takes longer than normally. An additional pressure gauge on the backside is recommended. Maximum input pressure: 10 bar 3.3.
Daily Maintenance 3 Poisonous Gases Flammable Gases Oxidizer Gases Copyright © 2012 EVG 11 218 of 370
Preventive Maintenance Manual 3.4 Bond Tools Visually inspect the bond tool surface. There should be no deposits or scratches visible. Clean the bond tools with alcohol. Particularly the top and bottom surface of the bond chuck insert.
Daily Maintenance 3.4.1 3 Bond Tool Insert The bond tool insert should have the same thickness (8mm) all over the surface. Required tools: • Sliding caliper • Wafer pieces with defined thickness (e.g. 500 μm) a) Put the wafer pieces on the top and bottom side of the pressure insert. The bond tool frame is probably higher than the bond tool insert. This is the reason why we need the wafer pieces. b) Take the sliding caliper and measure the whole stack thickness.
Preventive Maintenance Manual c) Bond tool insert thickness = measured value – wafer thickness e.g. measured value 9,2mm; wafer thickness 500 μm 9,2 mm – 2 x 500 μm = 8,2 mm bond tool insert thickness d) Repeat the measurements on these points 120° Figure 7 e) Repeat this measurement procedure on all bond tools f) All measured points should have the same value If there is one “bad” measurement point, we recommend sending back the bond tool for further analyses at EV Group.
Daily Maintenance 3.5 3 Flags Make a visual inspection of the flags on the bond tools. Ensure that the flags are not bent, and that the screws which hold them in place are secure. The flag height must be higher than the bottom wafer.
Preventive Maintenance Manual 3.6 Clamping Feet 1) Ensure that the clamping feet mechanism is working smoothly and all screws are tightened. 2) Replace the springs of the clamping feet mechanism for preventive maintenance.
Daily Maintenance 3.7 3 Clamping Force Note: Wrong adjusted clamp force can cause misalignment during the bonding sequence. 3.7.1 Required Tools The following tools are required in order to measure the clamps: 3.7.1.1 Spring Balance Figure 9 - Spring Balance 3.7.1.2 Measurement Fitting Figure 10 - Measurement Fitting 3.7.1.
Preventive Maintenance Manual 3.7.2 Prepare Bondchuck Figure 12 - Bondchuck 1 2 1 Bondchuck 2 Desk The Bondchuck has to be positioned on the desk as shown in the picture above. It should be around 5 cm above the desk edge in order to perform the measurement with the Clamp Measurement Tool.
Daily Maintenance 3.7.3 3 Prepare Clamp: Move Flag / Clamp Inside Move the Clamp towards the center of the Bondchuck. 3.7.
Preventive Maintenance Manual 3.7.5 Install Spring Balance Figure 15 - Installing Spring Balance 3.7.
Daily Maintenance • 3 Insert the Measurement plate between the Flag and the Bondchuck: 2 1 Figure 17 - Insert Measurement Plate 1 Measurement plate 2 Flag Lift off between measurement plate and flag should be reached at a clamping force of: see next chapter 3.7.7 Clamping Force The appropriate clamping force range depends on the wafers that are clamped. The following table gives a guideline.
Preventive Maintenance Manual 3.7.8 Adjustment of Clamping Force Figure 18 - Grub screw The grub screw adjusts the height of the clamping arm and therefore also the pressure, which is applied to the wafer stack. Figure 19 These screws are used for the “fine tuning” and for fixing the position of the clamping arm. Figure 20 - Clamping arm After this procedure check the clamping force again. Repeat these steps until you reach the desired result.
Daily Maintenance 3.7.9 3 Check the clamping force with a Force Gauge The appropriate clamping force range depends on the wafers that are clamped. Any deviation from standard wafers (non-Si wafers, special shape of the wafer edge, thinner wafers, defective edge,..) requires an investigation of the appropriate clamping force.
Preventive Maintenance Manual 1 2 3 Figure 22 - Front view 1 Table 2 Force Gauge 3 Regulator The appropriate clamping force is measured by using the Force Gauge, which is situated under the table.
3 Daily Maintenance Measurement: Turn the regulator until the measurement plate fits under the flag. The measurement plate should fit under the flag when a clamping force of about 10N is reached.
Preventive Maintenance Manual Figure 20 – Clamping force of 8 N 3.8 Clamping glasses Make a visual inspection of the clamping glasses. Insure that there are no scratches or cracks.
Weekly Maintenance 4 4 Weekly Maintenance 4.1 Before starting Weekly Maintenance Perform daily maintenance as described in the previous chapter. 4.2 Error Tracking: Memory Leak We recommend restarting the system computer and the Microsoft Windows operating system in a regular interval, like during the weekly pre-maintenance, to avoid problems and to ensure a stable production environment. 4.3 4.3.1 4.3.1.
Preventive Maintenance Manual Note: The increase factor depends on the system. Use factor 10 for 40kN and factor 16 for 60kN! 28 • Medium separator (used to accomplish hydraulic piston up function) • V/P (voltage/pressure) converter; software-controlled prop. Valve, which generates control pressure (0 – 5500mbar, 0 – 550kPa) for the pressure-converter.
Weekly Maintenance 4 MAC valve (old systems) SMC valve (new systems) In order to apply piston pressure (=apply force onto the wafer stack), please see following section. For better understanding, please see schematic drawing on next page.
Preventive Maintenance Manual 4.3.1.2 Applying Piston Pressure in Manual Mode • The pressure cover has to be closed and locked. Software interlock will prevent the system from applying piston-pressure with pressure-head open. • A bond tool has to be in the chamber in order to avoid destruction of the pressure-disc caused by the bottom-heater chuck-centering pin. After starting up the EVG Bonder software, please open up the “Manual Setup” (6” systems) or the “Bonder diagnostic” (8” systems & EVG560).
Weekly Maintenance 4.3.1.3 4 Troubleshooting Max. Pressure cannot be achieved or hydraulic pressure is OFF • • • • Inlet air-pressure too low: Check inlet pressure to be at 6bar (600kPa) /87psi Adjustment of V/P converter is off or the V/P-converter is bad: Check pneumatic pressure with a gauge (see values in above table) and call EVG Service Stack height too low: Increase stack height and try again Hydraulic system contains air: Fill/bleed the system (Filing / Bleeding the hydraulic system) Max.
Preventive Maintenance Manual 4.3.1.
Weekly Maintenance 4.3.1.5 4 Filling / Bleeding the hydraulic system Figure 25 Filling bleeding of the upper hydraulic circuit 1) Press Piston up button 2) Open the pressure cover. Again make sure the piston is in its upper position and the piston up pressure-regulator is set to 2 bar (200kPa). 3) Close cover. 4) Make sure, enough hydraulic fluid is in the header-tank.
Preventive Maintenance Manual Filling / bleeding the 2nd hydraulic circuit 1) In order to fill the lower hydraulic circuit, the piston must be in its lowest position. 2) Make sure that there is no bond chuck loaded. 3) Remove the center pin on the bond chuck. Figure 27 34 4) Screw the wafer bow scale complete down and turn it up again 1mm. 5) Activate the wafer bow (software) to move the piston down in its lower position. Make sure the Piston is moving down to its lower position.
Weekly Maintenance 6) 4 Disconnect the transparent hose leading to the manual shutoffvalve and connect a funnel mounted on a hose on the shutoff valve. The funnel must be higher than the cover.
Preventive Maintenance Manual 7) Fill the funnel with hydraulic fluid and open the shutoff-valve. 8) Now connect a short hose on the lower screw of the pressure head (picture below), open it one rotation and wait again until the fluid comes out without any bubbles. Then tighten the screw and close the shutoff valve. Figure 29 9) Remove hose and funnel and reconnect the blue hose to the shutoff valve. 10) Move the Piston UP.
Weekly Maintenance 4.3.2 4.3.2.1 4 Hydraulic System Upgrade (currently used) Schematics Without back pressure control Figure 30 - Hydraulic System without backpressure control Note: “Piston up” and “pressure-converter up” are connected and use a pneumatic pressure of 2bar. A medium separator is used to build up a hydraulic pressure of 2bar to drive the hydraulic piston up. The hydraulic-cylinder is a “double-acting” cylinder with hydraulic-function for up and down motion.
Preventive Maintenance Manual With backpressure control Figure 31 - Hydraulic System with backpressure control Note: An additional output (pneumatic valve) is equipped for better force accuracy control. After piston down the “piston up low/vent” valve gets activated and pressurizes the piston up at 0,2bar. This pressure compensates the friction of the hydraulic gaskets and allows better force-control in the low range.
Weekly Maintenance 4.3.2.2 4 New Hydraulic System Function description Other than on the old hydraulic system, the new hydraulic-cylinder is only a single-acting cylinder anymore. This means, only the “piston down” function is a hydraulic; the “piston up” function is now executed by a pneumatic-cylinder on top of the Hydraulic-cylinder. This makes the medium-separator and other components in the hydraulic-system obsolete, they can be removed.
Preventive Maintenance Manual Schematics without backpressure control Figure 32 - Hydraulic System without backpressure control Note: Pneumatic cylinder inside the hydraulic cylinder assembly uses a “piston up” pressure of 6bar. The pressure-converter uses a pressure of 2bar only. The separation-tank is connected to the hydraulic-cylinder and the pressure converter through 2 independent leak lines.
Weekly Maintenance 4 Schematics with backpressure control Figure 33 - Hydraulic System with backpressure control Note: The pressure-converter is driven back by the “piston low” pressure (0,2bar) only. This pressure is attached permanently.
Preventive Maintenance Manual 4.3.2.3 Installation of the Upgrade Components Following part numbers (bill of materials) contain the necessary parts for the upgrade: SP5000495 Hydraulic unit single acting w/o bow SP5000496 hydraulic unit single acting w. bow Both BOM’s contain the same fittings and tubes, only difference is the setup of the cylinder with or without wafer bow adjustment. Installation of the new hydraulic cylinder The change of the cylinder has to be done same way as before.
Weekly Maintenance 4 Remove Top Cap Figure 35 - Top Cap Align hole in the piston rod to the hole in the cap and lock them by sticking an allen key through. Then loosen screw on top.
Preventive Maintenance Manual Loosen center bolt and take square plate off Figure 37 - Square Plate Install piston rod 1 Figure 38 - Piston Rod Install cylinder on pressure head 1 Use spanner 16mm to hold the piston rod. Note: If necessary to rotate the whole piston-rod assembly, always rotate clockwise to not loosen any bolted connections inside the cylinder. After assembling install square cylinder base-plate again and tighten center bolt (use Loctite).
Weekly Maintenance 4 Note: Make sure to hold the piston rod in position to not tear the vacuum bellows). Then align the square base-plate inside the square cutout again. Assemble pressure-head in reverse order.
Preventive Maintenance Manual Removing of obsolete parts Some components are not necessary with the new hydraulic-system anymore and can be removed Medium separator unit Figure 39 - Medium separator unit Valves for piston up low/vent and medium separator venting valve 1 Figure 40 - Valves 1 46 Disconnect connection cable on the XCO board in the electronics section Copyright © 2012 EVG 253 of 370
4 Weekly Maintenance Changes on the pneumatic system Please refer to schematics section 2.1.1 and 2.1.2 and this page for details.
Preventive Maintenance Manual Pneumatic connections on the cylinder Figure 43 - Pneumatic Connections 1 1 Connect the “down” line at the wafer bow quick connector. Bleeding the system Follow existing routine to bleed the hydraulics. Note: The “piston up” circuit does not exist anymore. For easier bleeding disconnect the pneumatic “up” and “down” line while the piston is in upper position.
Weekly Maintenance 4.3.2.
Preventive Maintenance Manual Piston low pressure (2): • • • • with 1/10 pressure-converter (SAP#10022086): 0,2bar with 1/16 pressure-converter (SAP#10027676): 0,3bar used for backpressure control located inside the bonding-module 2 Figure 45 - Piston low pressure 50 Copyright © 2012 EVG 257 of 370
Weekly Maintenance 4 Maximum stack height measurement: 1) • • 20/40kN systems (cylinder diam. 100mm) SAP# 10032562 (with wafer bow unit) SAP# 10032368 (without wafer bow unit) With wafer bow unit: Set stack thickness to 20mm and apply “wafer bow” using the Low Level functions (clear “piston up” before). Then apply caliper as shown in the figure below, set to “0” and execute “piston down” (empty bondchuck loaded in the chamber) and check stroke. Typically, the stroke will be in the 18 +/- 1mm range.
Preventive Maintenance Manual Without wafer bow unit: Set the ring to its very high position and proceed like listed above. Figure 47 - Setting the ring 2) • • 60/100kN systems (cylinder diam. 140mm) SAP#10032856 (with wafer bow unit) SAP#10033010 (without wafer bow unit) With wafer bow unit equipped: Set stack height to 0 and proceed with measurement.
Weekly Maintenance 4 Without wafer bow equipped: Set ring to its very lower position and proceed with measurement. With piston in upper position, remove center aluminum plate (see this manual page 9) and apply caliper as shown in the figure below. Set caliper to 0 before measurement. Figure 48 - Apply Caliper Execute piston down (empty bond tool loaded) and check stroke. Note: This different routine is necessary due to the higher hydraulic fluid volume of the larger cylinder.
Preventive Maintenance Manual Tech tips hydraulic-cylinders with wafer bow unit: Never set the stack-height above 20mm and execute a piston down. Otherwise there could be force transferred on the pneumatic-cylinder piston rod and causing the “predetermined break point” to break.
Weekly Maintenance 4 load-cell (if equipped): Figure 50 - Load Cell Check through the plexi-glass window and make sure the cable can move free during any piston-motion. loadcell test: Prior to doing the loadcell test, make sure the wafer bow is adjusted so that it doesn’t touch the loadcells after executing the “wafer bow” command. There should be no force reading on the loadcells after “wafer bow”.
Preventive Maintenance Manual 4.4 High Voltage Any use by unauthorized personnel or careless handling may increase the potential danger. www.EVGroup.com ! CAUTION HAZARDOUS VOLTAGE Risk of electric shock Trained and authorized personnel only SAP# 10023459 Figure 51 - Caution! Hazardous Voltage To check the function of the high voltage power supply the cover must be closed! 1) Enter a Voltage setpoint and Current limit in the Voltage window and press OK.
Weekly Maintenance 4.5 4 Cover Clamps Check the pneumatic connection of the cover clamps for cracks and leakages. Check that the sensors on the clamps are tightened. Figure 53 - Clamps Check that the four clamps on each chamber are closed and locked well and if they open smooth again. Check the inputs in the Low IO, Chamber x „GW XCO #1-C3“: Status will become green when the input is present.
Preventive Maintenance Manual Status of the cover clamps: clamped and locked unclamped and locked unclamped and unlocked Cover locked, Cover unlocked end switch Cover unclamped, Cover clamped end switch 58 Copyright © 2012 EVG 265 of 370
Weekly Maintenance 4 The end switches are wired in series (from cover clamp 1 -> 4). If one end switch is not adjusted the input is missing in the software. 4.5.1 2 3 1 4 Working principle Cover locking mechanism consists of locking clamp (c-hook), which is pivoted on an eccentric shaft. Attached to this eccentric shaft there are two locking levers. Once locking clamp is in lock position, eccentric shaft is twisted by applying force to the locking levers.
Preventive Maintenance Manual 4.6 4.6.
Weekly Maintenance 1) 4 Prepare wafer bow pin calibration tool Figure 55 - Wafer Bow Pin Calibration Tool Copyright © 2012 EVG 61 268 of 370
Preventive Maintenance Manual 62 2) Prepare bond chamber 3) Load bond chuck 4) Remove blanking flange on bond cover.
Weekly Maintenance 4.6.1.1 5) Open Cover and insert Calibration Tool in opening. (Second person shout hold the Calibration Tool/sheet with soft tension. Otherwise Calibration tool/sheet could be crumpled) 6) Close bond cover. 7) Adjust calibration sheet to marking 1. 4 Check correct adjustment • • • Set the stack height to 500µm. Activate wafer bow and pull out the paper strip. It should be possible to pull it out slightly.
Preventive Maintenance Manual Wafer bow overlap: 3mm (use a depth gauge to check!) Figure 56 - Check Wafer Bow overlap 4.6.1.2 64 Adjust wafer bow pin 1) Rotate adjustment ring for stack height quite to the bottom 2) Activate wafer bow and pull at the paper strip. If it is clamped, deactivate wafer bow, rotate the adjustment ring a bit up and activate wafer bow again.
Weekly Maintenance 4.6.1.3 4 CAN System To activate wafer bow pin press high level command “Wafer Bow Pin”. To deactivate wafer bow pin press high level command “Piston Up”. 4.6.1.4 Adjustment Calibration Schematic 1) Try until you can pull the strip out slightly (until the bow-pin looses contact to the paper strip Wafer bow – zero contact. It may be necessary to rotate the adjustment ring for- and backwards until you have found the exact zero-contact position.
Preventive Maintenance Manual 3) Open the 3 setscrews on the adjustment ring hold the bottom-part of the adjustment ring and just rotate the scale. “0” must appear on front. 4) After that loosen the 2 screws in front (screws which hold the millimeter ruler) and set the ruler to “0” position.
Weekly Maintenance 4.7 4.7.1 4 Uniformity Check Pressure Film Test Needed equipment: • • • 2 SI Wafer with blank surface Pressure film Ultra Low 13,1' 28-85PSI Bondchuck Figure 57 - Needed Equipment For the pressure film test two different pressure films are necessary, one more clear and one white film. Cut out one peace of each pressure film that has the same size than the wafer. Now place first a wafer and than the white pressure film (blue bag) on the bond chuck.
Preventive Maintenance Manual Figure 58 - SI Wafer - Pressure Films – Chuck Finally place the second SI Wafer on the chuck and clamp the wafer stack with the pressure film in between.
Weekly Maintenance 4 Figure 60 - Pressure Film Test Result Place the bond chuck in the chamber and apply a piston force according to the table below. After 30sec of delay release the piston force and remove the tool from chamber. Unclamp the substrate manually and remove the top wafer + top pressure film carefully. You can see the result of the pressure film test on the bottom pressure film.
Preventive Maintenance Manual 4.7.2 Check Flatness Check the flatness of the Pressure Insert and the Bond Chuck with a straight edge. Make sure that the surface is absolutely even and no spots are visible. Figure 61 - Flat Bond Tool In order to check the flatness of a bond chuck accurately, check the flatness two times in a 90° angle.
Weekly Maintenance 4.7.3 Heater Flatness 4.7.3.1 Bottom Heater 4 Make a visual check of the Heaters. Check the flatness of the heater with a straight edge and a feeler gauge. Figure 62 - Bottom Heater Figure 63 - Bottom Heater As seen below there is a gap (1) between the heater and the straight edge.
Preventive Maintenance Manual 1 Figure 64 - Bottom Heater The gap between the heater and the straight edge can be measured with feeler gauges and a measuring gap (see below). feeler gauges measuring gap Note: Standard factory setting is 10 to 15µm concave.
Weekly Maintenance 4.7.3.2 4 Top Heater Make a visual check of the top heater. Check the flatness of the heater with a straight edge. Make sure that there is no gap between the top heater and the straight edge. Figure 65 - Top Heater 4.7.4 Bond Tool Flatness Check the flatness of the bond chuck insert with a straight edge. Make sure that the surface is absolutely even and no spots are visible.
Preventive Maintenance Manual 4.7.5 Compliant Layer Graphite 6” Make a visual check of the compliant layer graphite. Make sure that the surface is absolutely even and no spots are visible.
Weekly Maintenance 4.8 4 Flag Pulling Mechanism Manually activate the flag pulling mechanism: Figure 68 - Flags on Bond Tool Ensure that the flag pulling mechanism is working smoothly, and that there is no debris that might cause a flag to fail. There shouldn’t be any cracked waferpieces in the bellow of the pulling mechanism.
Preventive Maintenance Manual 4.8.1 Adjustment of Flags Perform the following steps for all three flags: Figure 70 - Flag on Bond Tool Place a wafer (e.g. a piece of broken wafer) between the bond tool surface and the flag. 4.8.1.
Weekly Maintenance 4.8.1.2 4 Flag Orientation Make sure that the front end of the flag (1) is slightly higher than the other end of the flag (2) to prevent the flag from being twisted.
Preventive Maintenance Manual 4.
Weekly Maintenance 4 Replace the compliant graphite foils of the pressure disc: 1) If the System is an EVG520IS bring the Cover to Service Position first (remove the perforated plate “Covering top back” and bring the Cover into its service position). 2) Remove 5 pieces pressure disc clamps 3) Remove Pressure Disc 4) Remove carefully the two “Compliant Layer Graphite” (Number “1” and “3” in following drawing. It’s recommended to change both “Compliant Layer Graphite” because of evenness.
Preventive Maintenance Manual 6) Fix New Compliant Layer Graphite and Quartz Glass Pressure Disc with pressure disc clamps Adjustment: There is a notch on the side of the pressure disc (pictures below) and a notch on the heater. Align these to notches together! 1 2 2 3 Figure 78 1 If there is no notch on the side of the disc the notch above the disc must be exact in one line to the screw above / beneath. 2 80 3 Notch for electrode. If there is no notch remove the electrode.
Weekly Maintenance 4 Remove disc: It is easier to remove the four red marked clamps by using a small screwdriver first. The disc is still fixed by the two blue marked clamps (Figure 78) now. Mount disc in reverse order. There is a flattened side and a spring side on the clamp. Fix the disc with the flattened side (Figure 80 - Fix disc). 4 Figure 79 - Clamp Probably it is necessary to readjust the tension the spring side of the clamp if it is loosely.
Preventive Maintenance Manual 4.9.1 Adjustment of Pressure Disc Adjust the pressure disc as shown in Figure 81 and Figure 82. Figure 81 Concentric Figure 82 Make a visual check of the top side pressure glass. There should be no crack or spot detectable.
Weekly Maintenance 4.10 4 Cleaning For all cleaning processes the entire EVG5xx system must be switched off, and the heater temperature has to be below 50°C. Alcohol and a wipe suitable for clean rooms can be used for all cleaning actions. Clean all bottom heating chucks of bond chamber with alcohol. Clean the pressure disk of the top heater of pressure lids.
Preventive Maintenance Manual 4.11 Turbo Pump – Vacuum System The following Turbo Pumps are used on the EVG5xx systems (depends on vacuum system configuration). 4.11.1 Pfeifer – THM07x 1) Check the actual speed of the turbot pump in the LOW I/O: “GW TMH7x”. Turbo Pump must be in idle mode. 6 & 8inch System: 1500Hz 12inch System: 1000Hz 2) Check the motor current Turbo pump must be in idle mode. Motor current should be below 1A.
Weekly Maintenance 4 For troubleshooting refer to the OEM manual or contact EV Group.
Preventive Maintenance Manual 4.
Weekly Maintenance 4 Figure 85 - Water System Copyright © 2012 EVG 87 294 of 370
Preventive Maintenance Manual 4.13 Over Temperature Safety Devices Disconnecting the thermocouples at these devices must result in an error message and red LED (only Jumo controller) on the device must be on. Heating must not be possible any more. The device can be reset after reconnecting the thermocouples again and error can be quit. 4.13.1 4.13.1.1 Reset procedure TB45 Press the two reset buttons simultaneously. Figure 86 - TB45 - Over Temperature Safety Devices 4.13.1.
Monthly Maintenance 5 5 Monthly Maintenance 5.1 Before starting Monthly Maintenance Perform weekly maintenance as described in the previous chapter. 5.2 Cover connection lines 1) Check all lines (pneumatic, electric and water-cooling) for cracks and damage. 2) Make sure that the water and pneumatic lines are not crimped.
Preventive Maintenance Manual 5.3 Tool Detection Visually check the tool detection. Position of Tool Detection Sensors (1): The sensors must not be bent or loosen! 1 Figure 89 - Tool Detection Sensors Load a bond-chuck into the chamber and check “Tool not loaded” input in Low IO Chamber x “GW XCO #1-C3.
5 Monthly Maintenance 5.4 Piston Motion Check the movement of the piston. The motion of the piston has to be smooth and it must fully retract. 5.5 5.5.1 Load Cell Test Load Cell Test Bond Module 1) Open bond module cover. Figure 91 - Load Cell Test - Open Bond Cover 2) Remove the screw.
Preventive Maintenance Manual 3) Put the Load Cells into the chamber (use the adjustment plate) and thread the cables below the hole in the cover as shown in the picture below. 2 1 Figure 93 Note: If necessary fix the Load Cells with some tape.
Monthly Maintenance 4) Close the cover. Take care at the threaded cables! 5) Connect the measuring tool (depends on measuring tool). 5 Figure 94 - Load Cell Test - Measuring Tool 6) The display on the measuring tool must look as shown in below (depends on the measuring tool): If the display looks different press button “P1”. If measuring tool as shown in item 2 is used press button “CLR” to switch between the different sensors.
Preventive Maintenance Manual 7) Open the “Jobs” –window in the system software. Point with the mouse onto the Chamber –symbol and press left mouse button to open the additional menu for the chamber. Go to “Piston” and press button “Set Piston Force”. Figure 96 - Load Cell Test - Set Piston Force 8) Enter the force into field “Setpoint” and press “OK” to confirm. Figure 97 - Load Cell Test - Enter Piston Force 9) Start measurement.
5 Monthly Maintenance 5.5.2 Load Cell Test UV Bond Module 1) Open bond module cover. Figure 98 - Load Cell Test - Open Bond Cover 2) Remove the screw.
Preventive Maintenance Manual 3) Put the Load Cells into the chamber (use the adjustment plate) and thread the cables below the hole in the cover as shown in the picture below. 2 1 Figure 100 Note: If necessary fix the Load Cells with some tape.
Monthly Maintenance 5) 5 Remove the glass-plate (if installed) Figure 102 - Remove glass plate 6) Close the cover. Take care at the threaded cables! 7) Connect the measuring tool (depends on measuring tool).
Preventive Maintenance Manual 8) The display on the measuring tool must look as shown in below (depends on the measuring tool): If the display looks different press button “P1”. If measuring tool as shown in item 2 is used press button “CLR” to switch between the different sensors. 2 1 Figure 104 9) Open the “Jobs” –window in the system software. Point with the mouse onto the Chamber –symbol and press left mouse button to open the additional menu for the chamber.
Monthly Maintenance 5 10) Enter the force into field “Setpoint” and press “OK” to confirm. Figure 106 - Load Cell Test - Enter Piston Force 11) Start measurement. Sum up the three values [kN] on the display of the measuring tool and compare with the Setpoint. 12) Remove the measuring gauge and the load cell with caution. Don’t forget to install the glass plate (if equipped) and the screw shown in Figure 100 – Remove screw. 5.
Preventive Maintenance Manual 5.7 Check Voltage, Start/Stop, EMO, Mainswitch 5.7.1 Voltage Check that the three phases of the power supply are good, every time turning the main switch on. Only for EVG501, 510, 520 and 520IS: The three lamps above the main switch stand for the three phases. All of them must be on! If one or more phases are off, the bonder does not work correctly! Figure 107 - Main Switch - Three Phases (EGV501, EVG520, and EVG520IS) 5.7.
Monthly Maintenance 5.7.3 5 Check EMO Button Check if the emergency stop is functioning correctly: Pushing the emergency stop button must bring the system in a safe state position. System must not restart after the button gets unlocked.
Preventive Maintenance Manual 5.8 Vacuum System Check the functionality of the Vacuum System, depending on the vacuum system configuration. For the vacuum system specifications refer to the Acceptance Test Protocol.
Monthly Maintenance 5 Notice: Vacuum System is customized. The Vacuum is permanently checked by the software. Error message “MACH: General Vacuum missing!” pops up when the vacuum is missing. Figure 109 - Error message (Vacuum missing) 5.8.1 Maintenance Evacuate Figure 110 - Maintenance Evacuate • • • • 5.8.
Preventive Maintenance Manual • • • • • • • 5.8.
5 Monthly Maintenance 5.9 Safety Valve To check the function of the safety valve, increase the pressure on the purge gas regulator.
Preventive Maintenance Manual 2 1 3 Figure 115 5.10 1 Cap nut 2 Baffle 3 Counter nut Gauges The following Gauges are used on the EVG5xx systems (depends on vacuum system configuration). • Pfeifer HPT100 • Inficon BCG450 • Thyracont VSK42 • MKS Baratron • ATM23 For troubleshooting refer to the OEM manual or contact EV Group. Remove the gauges and ship them to EV Group or to the original manufacturer for cleaning and recalibration.
Monthly Maintenance 5.11 5 Roughing Pump Following Roughing Pumps are used on the EVG5xx systems (depends on vacuum system configuration). • • • • • Pfeiffer MVP 055-3 - min. Pressure: 2mbar Varian SH100 - min. Pressure: 6,6 x 10-2mbar Varian SH110 - min. Pressure: 6,6 x 10-2mbar BOC Edwards XDS5 - min. Pressure: 7,0 x 10-2mbar BOC Edwards XDS10 - min. Pressure: 7,0 x 10-2mbar The Endvacuum of the Roughing Pump can be checked by connecting an external gauge to the Roughing Pump.
Preventive Maintenance Manual 5.12.2 Close Cover Check if the status of “Cover” (1) changes from “open” to “closed” when the cover is closed. 1 Figure 117 - Status "Cover Closed" 5.13 5.13.1 Check of Sensors Leakage Sensor Put a paper strip underneath the leakage sensor to check the functionality. The sensor must release LED on the sensor will be off, error message “MACH: Leakage detected” will appear in the SW and the water flow will be stopped.
Monthly Maintenance 5 2 1 Figure 118 - Leakage Sensors 1 Paper Strip 2 Potentiometer Figure 119 - Position of Leakage Sensor Copyright © 2012 EVG 109 316 of 370
Preventive Maintenance Manual 5.14 Water filter Open the water filter and clean it. If there are any deposits in the sieve check your cooling water quality. To find the location of the water filter refer to the picture below. 5.15 5.15.1 Water Cooling/Glycol Mix Cooling Water Quality: Closed loop system filtered (100 micron filters); the cooling water must be mechanically clean, optically clear, without deposits, to keep the cooling circuit free from dirt and organic suspended matter.
5 Monthly Maintenance 5.16.1 Adjust Water Flow Figure 120 - Flow Meter 1) Close and open each flow meter to make sure that it does not stick and that the cooling line is not clogged.
Preventive Maintenance Manual 5.17 5.17.1 Cooling Chucks Bottom Side Cooling Chuck Turn the Bottom Cooling On/Off and check the status in the SW. Figure 121 - Cooling On / Off Check the movement of the Cooling chuck. Adjust sensors for Cool Chuck On/Off if necessary.
Monthly Maintenance 5.17.1.1 5 Adjust Endswitches – Bottom Cooling 1 2 Figure 122 - Endswitches for "Cooling Bottom ON/OFF" 1 Cooling Bottom ON 2 Cooling Bottom OFF If it is not possible to reach the two end switches (Figure 123 – Endswitches for “Cooling Bottom ON/OFF”; 1 and 2) for any adjustments, it is necessary to dismount the bond module (loosen the two fastening screws). Caution: Do not peg out the connectors.
Preventive Maintenance Manual On the newer systems only one end switch (3) is used for ON/OFF.
5 Monthly Maintenance To adjust the end switch press the button (4) and turn the cooling on and off.
Preventive Maintenance Manual 5.17.2 Top Side Cooling Chuck 1) Optical Check of the System 1 L Figure 123 116 2) Check if locking nuts (1) are tightened as shown in previous drawing. 3) Check if the movement of cool chuck up and down is smoothly and parallel. 4) Apply cooling ON/OFF in the SW and check “Cool Top off” input in Low IO Chamber x “GW XCO #1-C3.
Monthly Maintenance 5.17.3 5 Cooling Time Check the Cooling Time of the system. 1) Load bond chuck with wafer into chamber 2) Close chamber 3) Evacuate till 5mbar 4) Fill chamber with N2 5) Piston Down with low force (appr.1000N) 6) Heat chamber till 400°C with both heaters if the max. temperature of the system is 550°C. If the temperature of the system is limited <400°C use the max. temperature limit for this test, i.e.: 200°C, 250°C.
Preventive Maintenance Manual 5.18 5.18.1 UV-Light Integrator Adjustment Check Assembling of UV Sensor 1) Disassemble Sensor: 1 2 3 1 Filter 2 Hole in the plate 3 Photodiode Attention: The Photodiode must be exactly at the position of the hole in the plate.
Monthly Maintenance 2) Put the filter into the device. It does not matter which side up. 3) Mount the plate with the hole at the position of the photodiode.
Preventive Maintenance Manual 5.18.2 Mount Sensor to the Light House 1) Mount the Sensor to the Light House like shown below: Note: Make sure the hole of the plate fits exactly to the hole of the lamp house. 2) 120 Connect the cable (Sub-D-9 pins) to the sensor.
Monthly Maintenance 5.18.3 5 Voltage Input Adjustment Note: For the adjustment please make sure that a new lamp will be used (installed). 1) Start trigger of UV-Lamp and check the voltage Input in the Low_Level_IO. 2) Find the board at the connection area bond module which is located on the left hand side of the bond module. Use a small slotted screwdriver to decrease or increase the voltage to ~4,25V.
Preventive Maintenance Manual 5.18.4 Monitor Signal Adjustment 1) Use external measurement tool to measure the real intensity of the new lamp. (For example 90 mW/cm2). 2) Open registry folder ……\Exposure 3) Check current Light integrator factor: (In this case 0.04) 4) 122 Turn ON UV-lamp and read current Lamp Power (e.g.
Monthly Maintenance 5) 5 Calculate new value for “LightIntegratorFactor” by using the following formula: LightIntegratorFactor = Current Factor Current Lamp Power x Real Lamp Power Example (using values from above): 0.04 60mW/cm² 6) * 90mW/cm² = 0.06 Change the registry parameter to the calculated value and restart IO_Serivce to activate the changes. Example: 7) After restarting the IO_Serivce the monitor signal should show the real value. (~90mW/cm2).
Preventive Maintenance Manual 5.19 Over Temperature Switch Check the function of the over temperature sensors. 5.19.
5 Monthly Maintenance 5.19.2 Bottom side 1 Figure 125 - Over Temperature Switch Bottom Side Disconnecting the over temperature sensor must disable the chamber check SW input Low IO General “XCO161 #11” Remove over temperature sensor and heat it with a hot air gun.
Preventive Maintenance Manual 6 Quarterly Maintenance 6.1 Checking Bond module and chuck Make a visual check of the Bond tool and the chuck. There should be no crack or spot detectable. The surface must be flat. 6.2 6.2.1 Chuck Polish Check Polish Bond Chuck Insert (Backside) Use EVG polishing tool (Arkansas stone) for maintenance procedure: Figure 126 - EVG Polish Tool 126 1) Clean the backside of the bond chuck insert with IPA. 2) Clean polishing tool with IPA.
6 Quarterly Maintenance Figure 127 - EVG Polish Procedure 4) After 20 circles clean up chuck insert and stone again with IPA. Repeat the steps above 10 times. 6.2.2 Thermo Chuck Use EVG tool (Arkansas) to polish: Figure 128 - EVG Polish Tool 1) Clean the surface of the thermo chuck with IPA. 2) Clean the polishing tool with IPA. 3) Polish the surface with the tool by sliding the stone in a circular movement (see below).
Preventive Maintenance Manual Figure 129 - EVG Polish Procedure 4) After 20 circles clean up chuck insert and stone again with IPA. Repeat the steps above 10 times. 6.2.3 6.2.3.
Quarterly Maintenance 6.2.3.2 6 Thermo Chuck The thermo chuck maintenance has to be done weekly. Figure 131 - Thermo Chuck 6.3 6.3.1 6.3.1.1 Adjust heater offset Short Description Temperature offset: The thermocouple sensors used on EVG bonding systems are very accurate, but still have a small measurement tolerance. That is why the same temperature reading on different EVG bonding machines may lead to a small temperature difference from bonder to bonder.
Preventive Maintenance Manual 6.3.2 How to adjust the temperature offset To adjust the heater offset click on: Options\General Settings\Heater Configuration (as shown in the window below): Here a temperature offset of +/- 5° C for every heater can be set.
Quarterly Maintenance 6 Afterwards the apply button has to be clicked for saving the new adjustment. This will not work if a process is running. In this case there will be a message that the IO service has to be restarted to apply the adjustment. These adjustments can only be done by administrators. 6.
Preventive Maintenance Manual 7 Annual Inspection Check the following points in addition to the monthly maintenance Tools needed for any PM. Metric Allen wrench set US Allen wrench set Metric open-end box end wrenches Philips head screwdriver (small and medium size) Flat head screwdriver (small and medium size) Volt meter Spare Latex gloves 7.1 Cooling Fluid Use a hydrometer to check if the fluid contains the proper percentage of Glycol. Ensure that the flow and pressure meets the specifications.
Annual Inspection 7.
Preventive Maintenance Manual Figure 134 - Water System 134 Copyright © 2012 EVG 341 of 370
7 Annual Inspection 7.3 Cleaning Procedure Clean all chambers with IP alcohol. After you have cleaned the whole chamber (including the heating chuck) wipe all surfaces of the bonder with IP alcohol. After you have cleaned everything, heat the chamber up to 300°C and evacuate it overnight. 7.4 Vacuum Pump Exchange the tip seal of the vacuum pump annually. 7.5 Vacuum Gauges Remove the vacuum gauges and ship them to the manufacturer for cleaning and recalibration. 7.
Preventive Maintenance Manual 7.9 Wafer bow Contact of the Piston Check if the wafer bow contacts the bond tool when you press wafer bow button in the bonder diagnostic. The adjustment has to be done by an authorized EVG service engineer. A yearly maintenance done by an EVG Service Engineer is strongly recommended.
8 Troubleshooting 8 Troubleshooting 8.1 Bonder doesn’t heat Bonder doesn’t heat Bonder doesn´t heat Check heater switch Heating Circuit Control Which LED´s are not ON ? ON OFF Turn on Check display OMRON Which LED ? Few ALL Transfer of desired temp. value TOP A TOP B TOP C BOT A BOT B BOT C OK Check Remote LED OMRON NOK Heating circuit XXX is defect ON Load process parameter again Call EV Service to change the heating circuit Check OUT LED OMRON ON Ref.
Preventive Maintenance Manual 8.
Troubleshooting 8.
Preventive Maintenance Manual 8.4 No High Voltage No High Voltage Check Ext.
9 Personal Protective Equipment (PPE) 9 Personal Protective Equipment (PPE) Chemical resistant latex gloves This PPE is required when working with Isopropyl alcohol or NH4OH contaminated units (cleaning chambers, brushes, etc…).
Preventive Maintenance Manual 10 Lockout/Tagout Mainswitch OFF and LOCK: Start und shutdown procedure Power OFF The sequence for powering down the system is: 1) Follow the guidelines for shutting down Windows 2) At the screen “It is now OK to turn off your computer”, Turn the main switch counter clockwise 90* to the OFF position Power ON The sequence for powering up the system is: 1) Turn the “Main Switch” clockwise 90* to the ON position Switch on the computer which is located behind the left door.
Facility Requirements 11 11 Facility Requirements Purpose / Type Volume / Specification Voltage: European System: 230V, +/- 5 %, 50/60Hz 3-phase, 5wire US System: 120V/208V, 5 wire system, +/-5%, 50/60 Hz (3-phase) Japan System: 200V, 4 wire system, 3-phase Nitrogen or compressed air (dried, cleaned): OD: 8 mm (3/8”) 6 bar (Minimum) – 8 bar (Maximum) 8bar (Minimum) – 10bar (Maximum) for 10kN and 60kN Bonders Purge gas: OD: 8mm (3/8”) 10 bar (Maximum) Cooling Water EVGroup’s cooling chucks a
Preventive Maintenance Manual 11.1 EVG520 Purpose / Type Dia./ Size Volume / Specification OD: 8 mm (3/8”) 8 bar (Minimum) – 10 bar (Maximum) Nitrogen or compressed air (dried, cleaned): Flow rate: Cooling water: 30 Liter/min (63,5 ft³/h) ID: 13mm Pressure: 3 - 5 bar (44 - 73 psi) Flow rate: > 9 Liter/min Power requirements: Maximum power input: 9.1kW (150mm heater configuration) 13.
Facility Requirements 11 History Date Modification by 2008-12-12 Formatted WAA 2009-03-06 Added “Adjust heater offset” SEB 2011-07-11 Updated topics with EVG501 manual WAA 2012-01-03 Reworked HBA 2012-11-15 Updated topic “Water Flow” HBA Copyright © 2012 EVG 145 352 of 370
Preventive Maintenance Manual EV Group Support: 146 Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG520_PM-Manual_PM_eng_10.
EaseUS Todo Backup Customer Support Documentation EVG EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St.
EaseUS Todo Backup Table of Contents 2 1 General Information .................................................................. 3 1.1 Introduction ....................................................................... 3 1.2 Start Backup Software ...................................................... 3 1.3 Pre-OS.............................................................................. 4 2 Create Backup ........................................................................... 5 2.
General Information 1 1 General Information 1.1 Introduction Recovering the system PC from a backup may be necessary if: • • • The operating system is working properly but other essential files have been damaged or deleted permanently. Essential files of the operating system have been damaged or deleted permanently and the system PC does not boot successfully. The system PC hard drive is damaged and the system needs to be restored after installing a new hard drive in the system PC.
EaseUS Todo Backup The backup software will be opened where all features and settings for backup and recovery can be set up. Figure 1 - Backup Home Screen Note: Maintenance Tools is only available depending on permissions of the user currently logged into the system. The following chapters describe how to backup, recover from a backup file and how to use the Pre-OS boot menu. 1.
Create Backup 2 2 Create Backup Backup or the operation of backing up always means creating copies of important data, with these additional copies, you can get your data back to previous health status after suffering an unexpected computer disaster. So the main purpose of backup operation can be considered as that to recover data as a reaction to system failure or data loss.
EaseUS Todo Backup 2.2 Creating a System Backup File Before creating a backup, make sure that there is a folder named with the current date in the format “YYYY-MM-DD” (“year-month-day”). This will ensure that different backup files can be easily found in the folder structure. Example: Select System backup from the Home or Backup page.
Create Backup 2 Select the destination folder (e.g. on a backup hard drive or network drive) and click Proceed to continue. Figure 3 - Select backup location Note: It is recommended to store the backup file on a network drive! Wait until the system backup process is finished and click Finish.
EaseUS Todo Backup 2.3 Create a Bootable Media Go to Tools and click Bootable media builder. Figure 5 - Tools page Select if the bootable media should be stored on a DVD or USB stick and click Proceed to continue.
Create Backup 2 Wait while the bootable media is created and then click Finish.
EaseUS Todo Backup 3 How to Recover Depending on the issue, recovery can be performed according to the following figure (e.g.
How to Recover 3 3.1 Recover from Backup File Go to Recovery page and click System recovery. Figure 8 - System recovery Select the recovery file location from the file browser (on local hard drive or network drive).
EaseUS Todo Backup Select which hard drive should be used as a recovery location. Figure 10 - Select recovery location Note: When you intend to recover under Pre-OS or bootable CD/USB environment, please make sure the entire path which contains the image file consists of ASCII characters only.
How to Recover 3 3.2 Recover with Bootable Media Turn OFF the system PC. Insert the bootable emergency DVD into the DVD drive of the system PC or plug the portable USB stick into a free USB port of the system PC. Turn ON the system PC. Wait for the boot menu to appear and select EaseUS Todo Backup to continue. Figure 11 - Boot menu from bootable media Follow the instructions on the screen to recover the system PC.
EaseUS Todo Backup 3.3 Recover using Pre-OS After switching on the system, the following boot menu will be displayed. Figure 12 - Boot menu for Pre-OS Choose EaseUS Todo Backup to start the Pre-OS backup tool or choose Windows to start the operating system on the system PC.
How to Recover 3 The software looks like in Windows except that some functions are disabled in Pre-OS. Go to Recovery and click System recovery. Follow the instructions in chapter 3.1 Recover from Backup File to recover the system PC in Pre-OS.
EaseUS Todo Backup History 16 Date Modification by 2011-10-24 First written with LES and KT WAA Copyright © 2011 EVG 369 of 370
How to Recover 3 EV Group Support: Phone: Fax: E-Mail: North America +1 480 305 2400 +1 480 305 2401 TechSupportUS@EVGroup.com Phone: Fax: E-Mail: Japan +81 45 348 1237 +81 45 348 0666 service@EVGroup.jp Phone: Fax: Korea +82 (2) 3218 4400 +82 (2) 3218 4401 Phone: Fax: E-Mail: All other locations +43 7712 5311 3000 +43 7712 5311 3500 TechSupportSD@EVGroup.com State: Released Author: WAA File: EVG_EaseUSTodoBackup_OO_eng_01.doc Created on: 2011-08-08 Printed on: 2011-10-24 Version: 1.
