Data Sheet

casambi.com
12
9. Soldering
9.1 Leadfree Reflow Soldering
Recommended temperature profile for leadfree reflow soldering
Maximum number of reflow cycles: 2
Opposite side reflow is prohibited due to the module’s
weight. (i.e. you must not place the module on the
bottom / underside of your PCB and reflow).
9.2 Hand Soldering
Hand soldering is possible. When using a soldering
iron, follow IPC recommendations (reference document
IPC-7711).
9.3 Rework
The module can be unsoldered from the host board.
Use of a hot air rework tool should be programmable
and the solder joint and module should not exceed the
maximum peak reflow temperature of 250°C.
If temperature ramps exceed the reflow temperature
profile, module and component damage may occur
due to thermal shock. Avoid overheating. Never attempt
a rework on the module itself, (e.g. replacing individual
components).
9.4 Cleaning
In general, cleaning the populated modules is strongly
discouraged. Residuals under the module cannot be
easily removed with any cleaning process. Use of “No
Clean” soldering paste is strongly recommended, as it
does not require cleaning after the soldering process.