Data Sheet

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11
7.2 Vertical mounting
CBM-003B/C can be mounted in vertical position
by using the soldering pads on the narrow end of
the module. There are two methods of soldering the
module in vertical position. It can be either soldered
between pin rows of a 2-row 1,27 mm pin header
(2 x 8P) or it can be soldered in a 0,9 mm slot routed
on the main board with soldering pads at the edge of
the slot. The thickness of the module printed circuit
board is 0,85 mm (+/- 0,1mm).
Suggested land pattern for vertical mounting in a slot
8. Mechanical Specifications
Mechanical dimensions.
Outline dimension tolerance typ ± 0,3mm, max ± 0,5mm. L 20±0.5mm W 12.7±0.3mm H 2.85±0.2mm